nanoX-AL
nanoX-AL COM Express Mini Size Type 10 Module with Intel® Atom™ E3900 series, Pentium®, and Celeron® SoC The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel® Atom™ processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution. The nanoX-AL features the dual/quad core Intel® Atom™ processor E3900 series supporting non-ECC type DDR3L single-channel or dualchannel memory at 1600/1867 MHz to provide excellent overall performance. Integrated Intel® Gen9 LP Graphics includes features such as OpenGL 4.3, DirectX 12, OpenCL 2.0 and support for H.265/HEVC, H.264, MPEG2, VC1, VP9, MVC, JPEG/MJPEG hardware decode. Graphics outputs include DDI ports supporting HDMI/DVI/DisplayPort and single-channel 18/24-bit LVDS (eDP by build option). The nanoX-AL is specifically designed for customers with balanced performance and power consumption requirements who want to outsource the custom core logic of their systems for reduced development time. The nanoX-AL has soldered type non-ECC DDR3L memory up to 8GB. In addition, onboard eMMC memory (8GB/16GB/32GB) and SD signals are available as build options. The nanoX-AL features a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
nanoX-BT
nanoX-BT COM Express Mini Size Type 10 Module with Intel Atom E3800 series SoC or Celeron Processors (codename: Bay Trail) The nanoX-BT is a COM Express COM.0 R2.1 Type 10 module supporting Intel Atom processor E3800 Series and Intel Celeron N2930/J1900 processor SoC (codename: Bay Trail). The nanoX-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution. The nanoX-BT features Intel Atom processor E3800 and Intel Celeron N2930/J1900 processor supporting non-ECC type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Integrated Intel Gen7 HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1 and support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include DDI ports supporting HDMI/DVI/DisplayPort and single-channel 18/24-bit LVDS (eDP is optional). The nanoX-BT is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. The nanoX-BT has soldered type non-ECC DDR3L memory for up to 4 GB. In addition, onboard eMCC memory (8/16/32GB) and SDIO signals are optionally supported. The nanoX-BT features a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 3 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
Q7-BASE
Q7-BASE Qseven® Reference Carrier Board Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET. The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for -PCI Express graphics cards in notebooks. The Qseven footprint is smaller than that of COM Express, ETX or XTX, responding to system designers' needs for minimal space. Qseven's power consumption envelope is below a 12 watts target, whereas SMARC's target is below 6 watts and COM Express can be well above 20 watts. Therefore, Qseven designs provide mid-range power values between those of SMARC and COM Express. The Qseven pincount is 230 compared to 314 and 440 for SMARC and COM Express (Type 2), respectively. Thus, it is optimized for designs with lower board-to-board pin requirements.
nanoX-TC
nanoX-TC COM Express® Mini Size Type 10 Module with Intel® Atom™ Processor No bigger in size than a business card, the nanoX-TC is a COM Express™ Mini form factor Type 10 pinout compatible computer-on-module that targets battery powered, mobile and handheld system designs. The new Mini size form factor with a footprint of just 55 mm x 84 mm is the smallest size in ADLINK's COM Express product lineup, next to the Basic size (125 mm x 95 mm) and Compact size (95x95) form factors. The nanoX-TC is based on the Intel® Atom™ Processor E6xx with less than 3.9 W thermal design power (TDP). These new 45nm Intel architecture processors implement ground-breaking power management techniques, making them ideal for thermally constrained and fanless embedded applications. The Processor E6xx series offers an integrated 2D/3D graphics engine with hardware encode/ decode, LVDS and SDVO output, HD Audio, PCI Express, and support for Intel® Hyper-Threading and Intel® Virtualization Technology. The Intel® EG20T Platform Controller Hub (PCH) provides additional I/O flexibility with SATA, UART, Gigabit Ethernet and USB host/client support. The nanoX-TC allows for innovative designs in mobile and "light" computing, including portable and mobile equipment for the automotive and test and measurement industries, visual communication and in the medical field. Using the Intel® Atom™ Processor E6xx and Intel® EG20T PCH chipset, the nanoX-TC allows developers to utilize a wide variety of mainstream software applications and middleware familiar to end users that will run unmodified with full functionality on this platform.
LEC-BW
LEC-BW SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. The ADLINK LEC-BTS computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BTS is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities. To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.
LEC-BTS
LEC-BTS SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. The ADLINK LEC-BTS computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BTS is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities. To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.
Express-SL/SLE
Express-SL/SLE COM Express Basic Size Type 6 Module with 6th Gen Intel Core, Xeon and Celeron Processors (codename: Skylake) ADLINK's COM Express computer-on-module (COM) offerings include the cExpress-SL and Express-SL in PICMG COM.0 Type 6 Compact and Basic Size form factors, respectively. Both Basic and Compact size modules are available with 6th generation Intel® Core™ i7, i5 or i3 processors and accompanying Intel® QM170 and HM170 Chipset. ECC memory is supported by models utilizing the Intel® Xeon® processor E3-15XX v5 family and Intel® CM236 chipset. DDR4 memory is supported up to a total of 32GB, with a lower voltage compared to DDR3 resulting in a reduction in overall power consumption and heat dissipation. These new COMs also provide support for three independent UHD/4K displays and are well-suited for applications in automation, medical, and infotainment, with extended operating temperature range optionally available for transportation and defense applications. The ADLINK Express-SL/SLE computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-SL/SLE is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Express-HR
Express-HR COM Express® Type 6 Module with Second Generation Intel® Core™ i7/i5/i3 processor and Mobile Intel QM67 Chipset The Express-HR is a COM Express™ COM.0 R2.0 Type 6 modules supporting the 64-bit Intel® Core™ i7/i5 processor with CPU, memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel® QM67 Express chipset, the Express-HR is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. The Express-HR features the Intel® Core™ i7/i5 processor supporting Intel® Hyper-threading Technology (4 cores, 8 threads) and up to 16GB of DDR3 dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity to the Intel® QM67 Express chipset. Integrated HD Graphics 3000 includes features such as OpenGL 3.0, DirectX10.1, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include CRT, LVDS and three DDI ports supporting HDMI / DVT / DisplayPort or SDVO. The Express-HR is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. The Express-HR has dual stacked SODIMM sockets for up to 16 GB DDR3 memory. The Intel® Mobile QM67 Express chipset integrates CRT and dual-channel 18/24-bit LVDS display output. In addition to the onboard integrated graphics, a multiplexed PCI Express® x16 Graphics bus is available for discrete graphics expansion or general purpose x8 or x4 PCI Express® connectivity. The Express-HR features a single onboard Gigabit Ethernet port, up to eight USB 2.0 ports, two SATA 6 Gb/s ports and two SATA 3 Gb/s ports with optional support for RAID 0/1/5/10. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
Express-HLE
Express-HLE COM Express Basic Size Type 6 Module with 4th Generation Intel Core i7/i5/i3 Processor with ECC memory (codename: Haswell) The Express-HLE is a COM Express COM.0 R2.1 Type 6 module supporting the 64-bit 4th Generation Intel Core i7/i5/3 processor with CPU (formerly codenamed Haswell), memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel QM87 Express chipset, the Express-HLE is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. The Express-HLE features the Intel Core i7/i5/i3 processor supporting Intels Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3 dual-channel memory at 1333/1600 MHz to provide excellent overall performance with ECC memory supported. Intel Flexible Display Interface and Direct Media Interface provide high speed connectivity to the Intel QM77 Express chipset. Integrated Intel Generation 7.5 includes features such as OpenGL 3.1, DirectX11, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI / DVI / DisplayPort. The Express-HLE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. The Express-HLE has dual stacked SODIMM sockets for up to 16 GB DDR3 memory. The Intel Mobile QM87 Express chipset integrates VGA and dual-channel 18/24-bit LVDS display output. In addition to the onboard integrated graphics, a multiplexed PCI Express? x16 Graphics bus is available for discrete graphics expansion or general purpose x8 or x4 PCI Express connectivity. The Express-HLE features a single onboard Gigabit Ethernet port, four USB 3.0 ports and four USB 2.0 ports, and 4 SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer. The ADLINK Express-HLE computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HLE is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Express-HL2
Express-HL2 COM Express® Basic Size Type 2 Module with 4th Generation Intel® Core™ i7/i5/i3 Processor (codename: Haswell) ADLINK"s Express-HL and Express-HL2 COM Express modules with 4th generation Intel® i7/i5 processor (codename: Haswell) - up to 3.1GHZ quad core - and mobile Intel® QM87 Express chipset offer up to 16GB dual channel DDR3L SDRAM at 1600MHz. The Express-HL is a COM Express Type 6 module offering three independent displays via DDI interface, as well as seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1), four SATA III (6 Gb/s), Gigabit Ethernet, four USB 2.0, and four USB 3.0 interfaces. The Express-HL2 features the COM Express Type 2 pinout and offers 18/24-bit single/dual channel LVDS, Analog CRT, and a legacy 32 bit PCI bus, as well as PATA IDE interface. The ADLINK Express-HL2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HL2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
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