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new Eagle Baseboard Eagle Baseboard 3.5 Inch Form Factor I/O Baseboard for ARM Computer-on-Modules The Eagle baseboard is designed to work with the Toradex Apalis family of ARM COMs. It turns the Apalis modules into complete embedded systems, with a wide variety of standard and industrial I/O features to create off-the-shelf solutions for ARM-based industrial embedded computing. Eagle provides a long life, scalable platform for ARM-based application development. Toradex’s Apalis module family currently contains three members, with the newest module, Apalis TK1, recently introduced in July 2016. The Apalis form factor, as well as all processors used on the modules, have long life commitments from their suppliers, ensuring long life availability of the complete product. Customers have great flexibility in selecting not only the price/performance characteristics of the installed COM, but multiple configurations including the number of cores, memory and flash size, and operating temperature range. Most I/O features can be configured to meet any customer’s specific requirements as well as cost and power consumption targets. This includes removal of unneeded features and I/O connectors plus additional ruggedization services. Supported ARM Computer-on-Modules Apalis iMX6 Apalis T30 Apalis TK1 Freescale i.MX6 NVIDIA Tegra 3 NVIDIA Tegra K1 ARM Cortex A9 ARM Cortex A9 ARM Cortex A15 Quad core dual core Quad core Quad core 1GHz / 800MHz 1.4GHz Up to 2.2GHz 512MB to 2GB DDR3 RAM 1GB or 2GB DDR3 RAM 2GB DDR3 RAM 4GB eMMC flash 4GB/8GB eMMC flash 16GB eMMC flash End of life 2028 End of life 2025 End of life 2025 Please visit the Toradex website, www.toradex.com, for more information about these ARM Computer‑on‑Modules. Customization Options The following customization options are available for the Eagle baseboard (minimum order quantities apply): 2 CANbus 2.0 ports via daughtercard 4 serial ports with opto-isolation 6 serial ports fixed RS-232 + 2 RS-232/422/485 8 3.3V GPIO instead of 4 opto in + 4 opto out +5VDC power input only Hardwired configuration (no jumpers) Conformal coating Connector and feature depopulation Software Development Kits Complete Software Development Kits with a bootable operating system are available with all the components you need to get started on your embedded design project. The kit contains a 32GB micro-SD flashdisk for Linux pre-loaded and a software DVD. Eagle Cable Kit The Eagle cable kit includes cables for Eagle's input and output. Many cables are also available individually.   This product is also available as a complete SBC with installed ARM module. Click here new Eagle ARM SBC Eagle ARM SBC 3.5 Inch Form Factor I/O Baseboard with installed ARM Computer-on-Modules The Eagle SBC combines the Toradex Apalis family of ARM COMs with a wide variety of standard and industrial I/O features to create off-the-shelf solutions for ARM-based industrial embedded computing. Eagle SBCs include the selected ARM module and heat sink pre-installed on the Eagle baseboard. Eagle provides a long life, scalable platform for ARM-based application development. Toradex’s Apalis module family currently contains three members, with the newest module, Apalis TK1, recently introduced in July 2016. The Apalis form factor, as well as all processors used on the modules, have long life commitments from their suppliers, ensuring long life availability of the complete product. Customers have great flexibility in selecting not only the price/performance characteristics of the installed COM, but multiple configurations including the number of cores, memory and flash size, and operating temperature range. Most I/O features can be configured to meet any customer’s specific requirements as well as cost and power consumption targets. This includes removal of unneeded features and I/O connectors plus additional ruggedization services. Supported ARM Computer-on-Modules Apalis iMX6 Apalis T30 Apalis TK1 Freescale i.MX6 NVIDIA Tegra 3 NVIDIA Tegra K1 ARM Cortex A9 ARM Cortex A9 ARM Cortex A15 Quad core dual core Quad core Quad core 1GHz / 800MHz 1.4GHz Up to 2.2GHz 512MB to 2GB DDR3 RAM 1GB or 2GB DDR3 RAM 2GB DDR3 RAM 4GB eMMC flash 4GB/8GB eMMC flash 16GB eMMC flash End of life 2028 End of life 2025 End of life 2025 Please visit the Toradex website, www.toradex.com, for more information about these ARM Computer‑on‑Modules. Customization Options The following customization options are available for the Eagle baseboard (minimum order quantities apply): 2 CANbus 2.0 ports via daughtercard 4 serial ports with opto-isolation 6 serial ports fixed RS-232 + 2 RS-232/422/485 8 3.3V GPIO instead of 4 opto in + 4 opto out +5VDC power input only Hardwired configuration (no jumpers) Conformal coating Connector and feature depopulation Software Development Kits Complete Software Development Kits with a bootable operating system are available with all the components you need to get started on your embedded design project. The kit contains a 32GB micro-SD flashdisk for Linux pre-loaded and a software DVD. Eagle Cable Kit The Eagle cable kit includes cables for Eagle's input and output. Many cables are also available individually.   This product is also available as a baseboard without the ARM module installed. Configure your own Eagle solution! Click here
new Zeta Miniature COM-Based SBC Zeta Miniature COM-Based SBC Ultra-Small Solution with Integrated DAQ using COM Express Mini Type 10 CPU Modules The Zeta COM Express SBC family of ultra-small embedded computer boards combines a COM Express Mini CPU module mounted on a same-size carrier board to create a complete embedded PC. Designed in the COM Express Mini Type 10 form factor (84×55mm/ 3.3×2.2 in), Zeta provides an ultra-compact, industry-standard form factor solution. 3 key components pre-assembled: A Computer on Module (COM) providing the core CPU functionality A carrier board providing the I/O transceivers and connectors, power supplies, and expansion sockets A heat spreader with a flat exterior surface for direct mounting and heat transfer to the system enclosure This layered architecture offers the highest functional density for any given footprint. As a comparison, Zeta offers functionality and performance equivalent to Diamond’s top-selling Aries SBC at just 40% of the size. Zeta currently supports three processor options: Intel Bay Trail E3825 1.33GHz Dual Core CPU with 2GB RAM Apollo Lake E3940 1.6GHz quad core CPU with 4GB RAM Apollo Lake N4200 1.1GHz (burstable to 2.5GHz) Quad Core CPU with 8GB RAM Zeta’s small size and high feature density make it an ideal choice for mobile applications. It stands ready to meet the challenges of these environments with a wide range 6-36VDC input voltage, a −40 to +85°C operating temperature range, and fanless heat spreader cooling (heat sink options are available). Benefits of COM-based SBCs The use of interchangeable industry-standard CPU modules on Zeta offers two important system designer benefits: Performance scalability: One can design multiple applications based on a consistent hardware platform and select the CPU that best fits the price / performance / power requirements of each one. In addition, as time goes on and your application needs more horsepower to support increased functionality, you can simply upgrade to a newer CPU with minimal to no redesign effort. Long product life: The majority of today’s x86 embedded processors offer limited lifecycles of 5-7 years, so any long-life product dependent on an x86 single-board computer (SBC) is likely to require redesign sometime during its lifecycle. Using industry-standard COMs lets you easily migrate to a new generation CPU module in the exact same form factor and containing the same feature set, with virtually no hardware or physical redesign efforts. Zeta is ideal for long-life applications such as Military, Medical, and Transportation. new Venus Venus 3.5 Inch Core i7/i5 SBC Based on the "Skylake" 6th generation Core i7/i5 U series processor with PassMark rating up to 4800, Venus offers the highest available CPU performance in a small form factor rugged SBC with modest power consumption. It incorporates a full suite of rugged features such as soldered memory, latching connectors, a thicker PCB, and true -40/+85ºC operating temperature, making it suitable for the most demanding vehicle applications. High I/O density, multiple expansion sockets, rugged design, modest power consumption of 14W, and wide temperature operation combine to make Venus an extremely attractive option for applications requiring high CPU performance or ruggedness.
new Diamond-MM-16R-AT Diamond-MM-16R-AT PC/104 16-Bit Analog I/O Module with Autocalibration The DMM-16R-AT features top performance and flexibility for a mid-range price. It has 16 single-ended / 8 differential analog voltage inputs with both unipolar and bipolar input ranges, programmable gain, and a maximum sampling rate of 100KHz. The 4 D/A channels and 16 digital I/O lines provide additional real-world control and monitoring capability. The full −40 to +85°C industrial temperature operation ensures reliable and accurate performance in any embedded system application. A fully-featured software library with example programs and a graphical user interface completes the solution to make the DMM-16R-AT a solid choice for PC/104 embedded systems requiring analog I/O. DMM-16R-AT is fully compatible with the original DMM-16-AT analog I/O module and can serve as a drop-in replacement offering reduced cost and enhanced digital I/O features. The mechanical design, connector type and pinout, and software interface are all identical the original board, eliminating any mechanical or software engineering efforts. new DIAMOND-MM-16RP-AT DIAMOND-MM-16RP-AT PC/104 16-Bit Analog I/O Module with Autocalibration The DMM-16RP-AT features top performance and flexibility for a mid-range price. It has 16 single-ended / 8 differential analog voltage inputs with both unipolar and bipolar input ranges, programmable gain, and a maximum sampling rate of 100KHz. The 4 D/A channels and 16 digital I/O lines provide additional real-world control and monitoring capability. The full −40 to +85°C industrial temperature operation ensures reliable and accurate performance in any embedded system application. A fully-featured software library with example programs and a graphical user interface completes the solution to make the DMM-16RP-AT a solid choice for PC/104-Plus embedded systems requiring analog I/O. DMM-16RP-AT is implemented as a PC/104-Plus board, however it features a novel dual bus interface. Both ISA and PCI connectors are installed and connected to the FPGA. The board will autoselect the PCI bus when present, however a jumper can be used to disable the PCI bus and force the board into ISA bus mode if desired. This allows the board to be used in both PCI and ISA bus PC/104 systems (assuming the PCI-104 connector does not pose a mechanical interference problem with other boards in the system). The board uses 3.3V signaling on the PCI bus and must be used only with 3.3V PCI bus SBCs. The ISA bus uses the standard 5V logic levels.
new Express-KL/KLE Express-KL/KLE COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 series and Intel® Xeon® Processors (formerly codename: Kaby Lake) The Express-KL/KLE is a COM Express COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename «Kaby Lake-H») with Mobile Intel QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution. The Express-KL/KLE features Intel Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR4 dual channel memory at 2133/2400 MHz with ECC/non-ECC support determined by CPU/chipset combination to provide excellent overall performance. Intel Flexible Display Interface and Direct Media Interface provide high speed connectivity from the CPU to the Intel QM175, HM175, CM238 Chipset. Integrated Intel Generation 9 Graphics includes features such as OpenGL 4.4/4.3/4.2, DirectX 11, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC 10-bit, MPEG2 hardware codec. In addition, High Dynamic Range is supported for enhanced picture color and quality and digital content protection has been upgraded to HDCP 2.2. Graphics outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option. The Express-KL/KLE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. The Express-KL/KLE has dual stacked SODIMM sockets supporting up to 32 GB of DDR4 ECC/non-ECC memory. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, eight PCIe x1 Gen3 lanes, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer. new nanoX-AL nanoX-AL COM Express Mini Size Type 10 Module with Intel® Atom™ E3900 series, Pentium®, and Celeron® SoC The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel® Atom™ processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution. The nanoX-AL features the dual/quad core Intel® Atom™ processor E3900 series supporting non-ECC type DDR3L single-channel or dualchannel memory at 1600/1867 MHz to provide excellent overall performance. Integrated Intel® Gen9 LP Graphics includes features such as OpenGL 4.3, DirectX 12, OpenCL 2.0 and support for H.265/HEVC, H.264, MPEG2, VC1, VP9, MVC, JPEG/MJPEG hardware decode. Graphics outputs include DDI ports supporting HDMI/DVI/DisplayPort and single-channel 18/24-bit LVDS (eDP by build option). The nanoX-AL is specifically designed for customers with balanced performance and power consumption requirements who want to outsource the custom core logic of their systems for reduced development time. The nanoX-AL has soldered type non-ECC DDR3L memory up to 8GB. In addition, onboard eMMC memory (8GB/16GB/32GB) and SD signals are available as build options. The nanoX-AL features a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
new COM Express® + GPU Embedded System COM Express® + GPU Embedded System A ruggedized small form factor embedded system with GPU The COM Express + GPU Embedded System from Connect Tech combines Intel® Skylake and Kaby Lake x86 processors with high-end NVIDIA® Quadro®, Tesla®, and GeForce™ Graphics Processing Units (GPU) all into a ruggedized small form factor embedded system. Choose from highest-end, highest-performance models or from low-powered extended temperature models all ideal for high-end encode/decode video applications or GPGPU CUDA® processing applications. This embedded system exposes all of the latest generation interconnect including: Gigabit Ethernet, USB 3.0 and 2.0, DisplayPort++, VGA, LVDS, SATA III, GPIO, I2C, mSATA, miniPCIe, PCIe/104 and SD Card Expansion. This embedded system uses all locking ruggedized positive latching connectors. VXG part numbers have Passive Heat Spreaders that are to be installed into a Customer Designed End Thermal Solution. DXG part numbers have an Active Cooling Solution with Integrated Support Frame. new TPSi2100 TPSi2100 100W Isolated Power Supply Tri-M's TPSi2100 is an isolated PC/104-Plus power solution, designed for embedded applications requiring isolation and clean power in rugged environments. With wide-range input voltages, transient suppression, galvanic isolation, and pluggable terminal mating plugs, this rugged design is ideal for any industrial application. For applications requiring a clean isolated power, the TPSi2100 is the perfect solution. This high density, small form factor, and unprecedented SWaP (size, weight, and performance) board is the perfect design for military, aerospace, transportation, and industrial applications. Advantages High efficiency Extended temperature operation Rugged design High voltage isolation 2250V input/output isolation 6000W transient suppression Active input voltage clamping Reverse polarity protection Clean and filtered power for the PC/104 bus Power/OS
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