DFI’s carrier board (also known as base board or evaluation board) offers a flexible engineering development environment for COM Express Type 10, Type 7, Type 6, Type 2, and Qseven. Which helps our customers minimize integration requirements while reducing development time and cost.
Technical specifications | |
Graphics |
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---|---|
Display |
1x VGA 1x LVDS/eDP (eDP available upon request) 3x DP 1x eDP/LVDS (LVDS available upon request) |
Expansion |
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Interface |
1x PCIe x16 1x PCIe x4 3x PCIe x1 1x M.2 B Key 3042/3052 1x SDIO |
Audio |
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Audio Codec | Realtek ALC888S-VD2-GR |
I/O |
|
Ethernet | 1x GbE (RJ-45) |
USB | 3x USB 3.1 (Gen 2) 4x USB 2.0 |
Display | 3x DP |
Audio |
1x Line-in 1x Line-out 1x Mic-in |
Internal I/O |
|
Serial | 1x Serial Interface Connector (TX/RX) |
Display |
1x VGA (2.54mm) 1x LVDS LCD Panel Connector 1x LCD/Inverter Power 1x eDP LCD Panel Connector |
Audio |
1x Audio (Line-out/Mic-in) 1x S/PDIF |
SATA | 4x SATA 3.0 (up to 6Gb/s) |
DIO | 1x 8-bit DIO |
LPC | 1x LPC |
SMBus | 1x SMBus |
Power |
|
Type |
12V, 5VSB, VCC_RTC (ATX mode) 12V, VCC_RTC (AT mode) |
Connector |
4-pin ATX 12V power 24-pin ATX power |
RTC Battery | CR2032 Coin Cell |
Mechanical |
|
Dimensions |
microATX Form Factor 244mm (9.6") x 244mm (9.6") |
Compliance |
PICMG COM Express R3.1, Type 6 & Type 10 Compact, Mini Module |
Environmental and physical specifications |
|
Temperature |
Operating: 0 to 60°C Storage: -40 to 85°C |
Humidity |
Operating: 5 to 90% RH Storage: 5 to 90% RH |
MTBF | 495,767 hrs @ 25C; 284,320 hrs @ 45C; 181,227 hrs @ 60C; 133,598 hrs @ 70C; 84,828 hrs @85C Calculation Model: Telcordia Issue 2, Method Case 3 Environment: GB, GC – Ground Benign, Controlled |
Certifications | CE, FCC, RoHS, UKCA |
Model | Description |
770‑COM3351‑000G | 1 GbE, 3 USB 3.1, 4 USB 2.0, power ATX/AT, with fan, 0 to 60°C |
332-553001-005G | Serial ATA data cable, length: 500mm |
770-EXTRS1-000G | LPC EXT-RS232 module, 4x RS-232 ports |
770-EXTRS1-100G | LPC EXT-RS485 module, 4x RS-485 ports |
A49-COM332-010G | I/O shield |