AMSTX-CF Series
Embedded Motherboard supporting MXM Graphics Module with 8th/9th Generation Intel Core i7/i5/i3 in LGA1151 Socket
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- ADLINK MXM Graphics module support (Type A/B, up to 120W)
- 8th/9th Gen Intel Core i7/i5/i3, Celeron processor
- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (CPU dependent)
- Operating temperature: 0°C to 60°C
Embedded graphics enables system developers to boost the performance of a wide range of workloads, including medical imaging, image analysis, compute acceleration, and artificial intelligence (AI). Leveraging graphics processing units (GPUs), embedded graphics can be used to increase application speed and accuracy, as well as decrease latency. Many embedded system developers are using embedded graphics solutions in real-world applications, such as medical, manufacturing, and traffic management, along with other embedded segments.
System developers, OEMs, and systems integrators can more easily deploy embedded graphics with help from ADLINK’s large portfolio of computing products that can be designed into a wide range of form factors.
The AMSTX-CF Series Micro-STX motherboard features socket-type CPU and support Scalable Graphics Processing Ranging from Pascal to Turing GPUs in a compact small form factor.
Combining its strong expertise serving embedded developers and its close partner relationship with NVIDIA, ADLINK is delivering high-performance, long-life embedded graphics solutions to many market segments.
| Technical specifications | |
| MXM Support |
AMSTX-CFP12-Q370: EGX-MXM-P1000/P2000/T1000/RTX3000/RTX5000 AMSTX-CFP12-H310: EGX-MXM-P1000/P2000/T1000/RTX3000/RTX5000 |
| Processor |
Intel Core i7-9700E, 2.6GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel Core i7-9700TE, 1.8GHz, 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel Core i5-9500E, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel Core i5-9500TE, 2.2GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel Core i3-9100E, 3.1GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel Core i3-9100TE, 2.2GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel Core i7-8700, 3.2GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel Core i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel Core i5-8500, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel Core i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel Core i3-8100, 3.6GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel Celeron G4900, 3.1GHz, 2M Cache, 54W TDP, LGA1151, DDR4 2400MHz support (2C/2T) Intel Celeron G4900T, 2.9GHz, 2M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/2T) |
| Chipset |
AMSTX-CFP12-Q370: Intel Q370 Chipset AMSTX-CFP12-H310: Intel H310 Chipset |
| Memory | Non-ECC DDR4 2666/2400MHz, 2x SO-DIMM, up to 64GB (dependent on CPU) |
| Display |
6x DisplayPort (2 from CPU, 4 from MXM) One internal HDMI (vertical connector from CPU), LVDS optional |
| Ethernet | 1x GbE (Intel i219-LM), 3x GbE (Intel i210-AT) |
| Serial Ports | 1x RS-232/422/485 pin header, 1x RS-232 pin header (CCtalk supported by jumper setting) |
| USB |
AMSTX-CFP12-Q370: 4x USB 3.2 Gen1 x1 ports, 2x USB 2.0 pin headers, 2x USB 3.2 Gen1 x1 pin headers AMSTX-CFP12-H310: 4x USB 3.2 Gen1x1 ports, 4x USB 2.0 pin headers |
| Audio |
Default: One 10-pin wafer(box header) for Mic-in/Line out/Line in Optional 1: Mic in /(6W speaker_out_L+6W speaker_out_R (on board 10-pin wafer. Connector via additional audio module) Optional 2: Line in /(6W speaker_out_L+6W speaker_out_R (on board 10-pin wafer. Connector via additional audio module) |
| M.2 |
AMSTX-CFP12-Q370: 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/BT module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module, 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module AMSTX-CFP12-H310: 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/BT module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module |
| PCB Edge Connector |
AMSTX-CFP12-Q370: 1x PCIe x8 PCB edge connector (data is from 2x PCIe Gen3 x4 root ports, one set of clocks, up to 50W), one PCIe power connector up to 12V @3.5A/5V@4A AMSTX-CFP12-H310: 1x PCIe x8 PCB edge connector (data is from 1x PCIe Gen2 x1 root ports, one set of clocks, up to 50W), one PCIe power connector up to 12V @3.5A/5V@4A |
| Digital I/O | One 1x 10-pin/2.0mm wafer: DI/DO: 4 in and 4 out |
| TPM 2.0 | Optional |
| eSIM | Optional |
| SATA |
AMSTX-CFP12-Q370: 2x SATA 6Gb/s, one SATA power connector 2x SATA 6Gb/s signals via M.2 M & B key connector Intel RST RAID Support AMSTX-CFP12-H310: 2x SATA 6Gb/s, one SATA power connector 1x SATA 6Gb/s signal via M.2 B key connector |
| Dimensions | 197.72 x 167.32 mm (W x L) |
| Mounting | ADLINK proprietary mounting hole locations, ADLINK proprietary CPU cooler bracket |
| DC Input | DC 12V input (Molex DC-in jack) |
| AC Input |
Optional: 240W (12V/20A) AC/DC adapter Optional: 500W (12V/41.7A) AC/DC power supply unit |
|
Environmental and physical specifications |
|
|---|---|
| Operating temperature |
0°C to 60°C (w/o MXM) 0°C to 55°C (W/MXM module except RTX-5000) 0°C to 45°C (W/MXM RTX-5000) |
| Storage temperature | -40°C to 85°C |
| Humidity | 5% to 95%, non-condensing |
| EMC | EN55032/35, EN61000-6-2/-4, CE, FCC Part 15B Class B(W/240W adaptor), Class A(W/500W PSU) |
| Model | Description |
| AMSTX-CFP12-H310 | Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with H310 Chipset, for MXM P1000/2000 support, with M.2 E/B key, with PCIex1 edge connector, WO/AMP for speaker-out, WO/TPM, WO/LVDS |
| AMSTX-CFP35-H310 | Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with H310 Chipset, for MXM P3000/5000 support, with M.2 E/B key, with PCIex1 edge connector, WO/AMP for speaker-out, WO/TPM, WO/LVDS |
| AMSTX-CFP12-Q370 | Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with Q370 Chipset, for MXM P1000/2000 support, with M.2 E/B/M key, with PCIex4 edge connector, WO/AMP for speaker-out, WO/TPM, WO/LVDS |
| AMSTX-CFP35-Q370 | Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with Q370 Chipset, for MXM P3000/5000 support, with M.2 E/B/M key, with PCIex4 edge connector, WO/AMP for speaker-out, WO/TPM, WO/LVDS |
| AMSTX-CFP12-H310, AMP/TPM/LVDS | Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with H310 Chipset, for MXM P1000/2000 support, with M.2 E/B key, with PCIex1 edge connector, W/AMP for speaker-out, W/TPM, W/LVDS |
| AMSTX-CFP35-H310, AMP/TPM/LVDS | Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with H310 Chipset, for MXM P3000/5000 support, with M.2 E/B key, with PCIex1 edge connector, W/AMP for speaker-out, W/TPM, W/LVDS |
| AMSTX-CFP12-Q370, AMP/TPM/LVDS | Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with Q370 Chipset, for MXM P1000/2000 support, with M.2 E/B/M key, with PCIex4 edge connector, W/AMP for speaker-out, W/TPM, W/LVDS |
| AMSTX-CFP35-Q370, AMP/TPM/LVDS | Intel 8th/9th Gen Core i7/i5/i3 LGA 1151 Desktop Processor with Q370 Chipset, for MXM P3000/5000 support, with M.2 E/B/M key, with PCIex4 edge connector, W/AMP for speaker-out, W/TPM, W/LVDS |
| LGA1150 CPU Cooler, H=61.4mm | For 65W CPU: Material: AL 6063 + Cooper1100, SIZE: 122.5 x128.96x61.4mm, Finish: CNC +anodic treatment, Fan DC12V 4500RPM±10%RPM~1000±400RPM, Green Part |
| 1.5U CU ACTIVE COOLER_90x90x35mm | For 35W CPU: FCLGA1151, R033, fan100%, 45'C, heat sink:D90x15mm, TIM: Grease X23-7762,D=38x0.15mm, Fan 80x80x20mm ,47.96CFM ,PWM 4pin,12V, (w/o back plate) |
| EGX-MXM-P1000/P2000_82x69.82x24.7mm | nVIDIA GPU P1000/P2000, heat sink, 82x69.82x24.7mm, TIM: CPU Grease 7762, 15x15x0.2mm, V-Ram Pad XR-HL 15.0x15.0x1.5mm, MOS pad RS300 6x38x2.0 mm, Fan: Ø55x11.2mm, PWM 4 pin, 12V |
| EGX-MXM-P3000/P5000_87x106.35x34mm | nVIDIA GPU P3000/P5000; heat sink,87x106.35x34mm; TIM: CPU Grease 7762, 21.5x18.5x0.2mm, V-Ram TIF 100,54x17x1.0mm, V-Ram TIF 100,27x15x1.0mm; Fan: Ø64.5x10.5mm, PWM 4 pin, 12V |
| EGX-MXM-T1000_82x69.82x24.7mm | nVIDIA GPU RTX1000 Heat sink, 82x69.82x24.7mm, TIM: CPU Grease 7762, 15x15mm, V-Ram Pad XR-HL 33.0x15.0x1.5mm, MOS pad RS300 6x38x2.0 mm, Fan: Ø55x11.2mm, PWM 4 pin, 12V |
| EGX-MXM-RTX3000_87x106.35x34mm | EGX-MXM-RTX3000, Heat sink, 87x106.35x34mm, TIM1: GPU Grease 7762, 27x25x0.2mm, Fan: Ø64.5x10.5mm, 4 pin, 12V |
