MicroMax's Solutions
MicroMax's Solutions
MicroMax's Solutions
Aurora
1.6GHz Atom Z530P PC/104 Single Board Computer
Aurora is a rugged, single board computer (SBC) based on the 1.6GHz Intel Atom Z530P CPU and conforming to the compact, PC/104-sized, SUMIT-ISM form-factor.
The SBC supports up to 2GB of DDR2 SO-DIMM SDRAM and provides high-resolution LVDS and SDVO graphics interfaces. Additional I/O ports include SATA, USB, serial, digital I/O, and Gigabit Ethernet. Flexible system expansion is based on industry-standard, stackable PC/104 (ISA) and SUMIT-A (PCIe) modules. A location is also provided for an optional on-board USB flashdisk.
Aurora's power-efficient design leverages Intel's ultra-low-power (Menlow) silicon platform, consisting of the Atom Z5xx (Silverthorne) processors and US15W chipset (Poulsbo). These ICs are positioned on the bottom of the board, resulting in easy and efficient heat removal via a heatspreader for wide-temperature, fanless operation.
Aurora is compatible with Linux, Windows XP, Windows Embedded Standard, Windows Embedded CE, and QNX. All necessary drivers are provided with the product.
Ruby-MM-416
4 Channel 16-bit Analog Output+24 DIO PC/104 Module
The new Ruby-MM-416 PC/104 module provides 4 channels of 16-bit resolution analog voltage output. The output range for each channel can be independently selected for 0-10V, ±5V, or ±10V with jumpers. All outputs are updated simultaneously, either with a software command or in response to an external signal. The board includes 24 lines of digital I/O using an 82C55 chip. The I/O connector pinout is compatible with the Ruby-MM-4 12-bit analog output board shown in our catalog on pages 20-21. Other features include +5V-only operation, individual DC/DC converters with filtered outputs for each DAC to supply ±15V for operation, and a six-layer circuit board to bury and shield the analog signals.
Ruby-MM-412/812/1612
4, 8, or 16-Channel 12-bit Analog Output‑PC/104 Module
The Ruby-MM series provides 4, 8 or 16 channels of 12-bit resolution analog voltage outputs plus 24 digital I/O lines on a single PC/104 module. An on-board precision voltage reference circuit offers analog output ranges of 0-2.5V, 0-5V, and 0-10V in unipolar mode or ±2.5V, ±5V, and ±10V in bipolar mode. All analog outputs can source or sink up to 5mA simultaneously.
The analog outputs are based on the DAC8412 quad 12-bit D/A converter chip. This chip resets all outputs to mid-scale on power-up, meaning 0V for bipolar ranges and 1/2 the full-scale voltage for unipolar ranges. To obtain power-on reset to 0V for unipolar ranges, a special-order version is available using the DAC8413 which powers up to zero scale instead.
On the 16-channel model, each group of 8 channels can be set for a different output range. On the 4- and 8-channel models, all outputs have the same output range. All outputs are updated simultaneously, either with a software command or in response to an external trigger.
The board includes 24 digital I/O lines using an 82C55 chip. All I/O lines have 10K Ohm pull-up resistors for guaranteed logic levels on power-up.
Ruby-MM-1612 is designed and tested for extended temperature operation (-40 to +85oC). It requires only +5VDC from the system power supply via the PC/104 bus. Analog ±15V supplies are derived from miniature DC/DC converters on the board. All I/O is contained on a single 50-pin connector compatible with standard .1” connector ribbon cables, such as Diamond Systems’ C-50-18.
IMB-M43-C236
Industrial ATX Motherboard with Intel Core i7/i5/i3 and Xeon E3 Processors
The IMB-M43-C236 is ADLINK’s ATX industrial motherboard, supporting the 6th/7th Generation Intel Core and Xeon E3-1200 v5/v6 processor in the LGA1151 package, and the Intel C236 Express chipset, the IMB-M43-C236 supports such high-speed data transfer interfaces as PCIe3.0, USB 3.0 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133/2400 MHz ECC or non-ECC memory up to 64 GB in four DIMM slots.
Delivering a scalable high performance platform for machine automation systems, machine vision systems, and testing & measurement applications, the IMB-M43-C236 enables intelligent selection of expansion interfaces from among 4xPCIe 3.0×4 lanes plus one 1xPCIe 3.0×8 lane, 2xPCIe 3.0×4 lanes plus 2xPCIe 3.0×8 lanes, or 2xPCIe 3.0×4 lanes plus 1xPCIe 3.0×16 lane.
Additionally, singularly robust I/O configuration enhances high speed data connection reliability via USB3.0, LAN and SATA, for maximum performance and compatibility.
EGX-MXM-P2000
Embedded MXM GPU Module with NVIDIA Quadro Embedded P2000
The EGX-MXM-P2000 features advanced NVIDIA Quadro GPU with NVIDIA Pascal Architecture technology in MXM 3.1 Type A form factor. The EGX-MXM-P1000 has 768 NVIDIA CUDA cores and a peak single-precision floating-point performance of 2.3 TFLOPS.
The EGX-MXM-P2000 has 4GB of GDDR5 memory and supports NVIDIA GPUDirect RDMA which helps increase data throughput by up to 80% and consequently system responsiveness by up to 60%.
Additionally, 4 UHD display outputs and an extended operating temperature range of −40°C to 85°C are supported.
The embedded graphics product is suitable for mission-critical harsh-environment edge computing applications with size, weight, and power (SWaP) and network connectivity constraints.
EGX-MXM-P1000
Embedded MXM GPU Module with NVIDIA Quadro Embedded P1000
The EGX-MXM-P1000 features advanced NVIDIA Quadro GPU with NVIDIA Pascal Architecture technology in MXM 3.1 Type A form factor. The EGX-MXM-P1000 has 512 NVIDIA CUDA cores and a peak single-precision floating-point performance of 1.8 TFLOPS.
The EGX-MXM-P1000 has 4GB of GDDR5 memory and supports NVIDIA GPUDirect RDMA which helps increase data throughput by up to 80% and consequently system responsiveness by up to 60%.
Additionally, 4 UHD display outputs and an extended operating temperature range of −40°C to 85°C are supported.
The embedded graphics product is suitable for mission-critical harsh-environment edge computing applications with size, weight, and power (SWaP) and network connectivity constraints.
Q7-BW
Qseven Standard Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC
Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET.
The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for -PCI Express graphics cards in notebooks.
The Qseven footprint is smaller than that of COM Express, ETX or XTX, responding to system designers" needs for minimal space. Qseven"s power consumption envelope is below a 12 watts target, whereas SMARC"s target is below 6 watts and COM Express can be well above 20 watts. Therefore, Qseven designs provide mid-range power values between those of SMARC and COM Express.
The Qseven pincount is 230 compared to 314 and 440 for SMARC and COM Express (Type 2), respectively. Thus, it is optimized for designs with lower board-to-board pin requirements.
The ADLINK Q7-BW computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Q7-BW is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
nanoX-TC
COM Express Mini Size Type 10 Module
No bigger in size than a business card, the nanoX-TC is a COM Express Mini form factor Type 10 pinout compatible computer-on-module that targets battery powered, mobile and handheld system designs. The new Mini size form factor with a footprint of just 55 mm x 84 mm is the smallest size in ADLINK's COM Express product lineup, next to the Basic size (125 mm x 95 mm) and Compact size (95x95) form factors.
The nanoX-TC is based on the Intel® Atom™ Processor E6xx with less than 3.9 W thermal design power (TDP). These new 45nm Intel architecture processors implement ground-breaking power management techniques, making them ideal for thermally constrained and fanless embedded applications. The Processor E6xx series offers an integrated 2D/3D graphics engine with hardware encode/ decode, LVDS and SDVO output, HD Audio, PCI Express, and support for Intel® Hyper-Threading and Intel® Virtualization Technology.
The Intel® EG20T Platform Controller Hub (PCH) provides additional I/O flexibility with SATA, UART, Gigabit Ethernet and USB host/client support.
The nanoX-TC allows for innovative designs in mobile and "light" computing, including portable and mobile equipment for the automotive and test and measurement industries, visual communication and in the medical field. Using the Intel® Atom™ Processor E6xx and Intel® EG20T PCH chipset, the nanoX-TC allows developers to utilize a wide variety of mainstream software applications and middleware familiar to end users that will run unmodified with full functionality on this platform.
LEC-BW
SMARC Short Size Module
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. The
ADLINK LEC-BTS computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BTS is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities. To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.
Express-IBE2
COM Express Basic Size Type 2 Module
The Module Computing Product Segment (MCPS) is pleased to introduce its latest COM Express Type 2 Module with Intel Core i7/i5/i3 Processor and QM77 Chipset, the Express-IBE2.
The Express-IBE2 is a COM Express COM.0 R2.1 Type 2 module with a 3rd Generation Intel Core i7/i5/3 processor and support for error-correcting code (ECC) memory.
Based on the latest Mobile Intel® QM77 Express Chipset, the Express-IBE2 is specifically designed for customers who need a highly reliable platform and/or continued support for PCI-bus and PATA IDE in a long product life solution.
The Express-IBE2 features the Intel Core i7/i5/i3 processor supporting Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3 dual-channel memory at 1066/1333/1600 MHz with error-correcting code (ECC). Integrated HD Graphics 4000 includes features such as OpenGL 3.1, DirectX11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and SDVO.
In addition to the onboard integrated graphics, a multiplexed PCI Express® x16 Graphics bus is available for discrete graphics expansion or general purpose x8 or x4 PCI Express® connectivity. The Express-IBE2 features a single onboard Gigabit Ethernet port, eights USB 2.0 ports, two SATA 6 Gb/s ports, two SATA 3 Gb/s ports and one PATA IDE port. Support is provided for SMBus and I2C.
The module is equipped with an SPI AMI EFI BIOS and supports SEMA (Smart Embedded Management Agent). SEMA functionality is consistent over ADLINK"s whole COM product line and provides the following embedded features : BIOS failsafe, voltage/current/temperature monitoring, power sequence control and monitoring, watchdog control, board info and statistics. SEMA comes with extensive software and library support for Windows, Linux, VxWorks and QNX.
The ADLINK Express-IBE2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-IBE2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
