MicroMax's Solutions
MicroMax's Solutions
MicroMax's Solutions
Express-IB
COM Express Basic Size Type 6 Module
The Express-IB is a high performance COM.0 R2.0 Type 6 module featuring an Intel Core i7/i5/i3 processor supporting Intel HD Graphics integrated on the CPU with three independent displays. A PCI Express x16 Generation 3.0 bus is available for discrete graphics expansion or general purpose PCIe (optionally configure as 2 x8 or 1 x8 + 2 x4).
The Express-IB targets applications in Government, Military, Medical, Digital Signage and Communications and is ideal for customers with advanced processing performance and graphics requirements looking to reduce development time by outsourcing the base design of their system and focusing on application functionality. The Express-IB supports Intel® Advance Vector Extensions (Intel® AVX v1.0), with its improved Floating Point Intensive Applications, and also offers the benefits of increased bandwidth provided by USB 3.0.
Express-HR
COM Express Type 6 Module
The Express-HR is a COM Express™ COM.0 R2.0 Type 6 modules supporting the 64-bit Intel® Core™ i7/i5 processor with CPU, memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel® QM67 Express chipset, the Express-HR is specifically designed for customers who need high-level processing and graphics performance in a long product life solution.
The Express-HR features the Intel® Core™ i7/i5 processor supporting Intel® Hyper-threading Technology (4 cores, 8 threads) and up to 16GB of DDR3 dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity to the Intel® QM67 Express chipset.
Integrated HD Graphics 3000 includes features such as OpenGL 3.0, DirectX10.1, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include CRT, LVDS and three DDI ports supporting HDMI / DVT / DisplayPort or SDVO. The Express-HR is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The Express-HR has dual stacked SODIMM sockets for up to 16 GB DDR3 memory. The Intel® Mobile QM67 Express chipset integrates CRT and dual-channel 18/24-bit LVDS display output. In addition to the onboard integrated graphics, a multiplexed PCI Express® x16 Graphics bus is available for discrete graphics expansion or general purpose x8 or x4 PCI Express® connectivity.
The Express-HR features a single onboard Gigabit Ethernet port, up to eight USB 2.0 ports, two SATA 6 Gb/s ports and two SATA 3 Gb/s ports with optional support for RAID 0/1/5/10. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
Express-HLE
COM Express Basic Size Type 6 Module
The Express-HLE is a COM Express COM.0 R2.1 Type 6 module supporting the 64-bit 4th Generation Intel Core i7/i5/3 processor with CPU (formerly codenamed Haswell), memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel QM87 Express chipset, the Express-HLE is specifically designed for customers who need high-level processing and graphics performance in a long product life solution.
The Express-HLE features the Intel Core i7/i5/i3 processor supporting Intels Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3 dual-channel memory at 1333/1600 MHz to provide excellent overall performance with ECC memory supported. Intel Flexible Display Interface and Direct Media Interface provide high speed connectivity to the Intel QM77 Express chipset.
Integrated Intel Generation 7.5 includes features such as OpenGL 3.1, DirectX11, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI / DVI / DisplayPort. The Express-HLE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The Express-HLE has dual stacked SODIMM sockets for up to 16 GB DDR3 memory. The Intel Mobile QM87 Express chipset integrates VGA and dual-channel 18/24-bit LVDS display output. In addition to the onboard integrated graphics, a multiplexed PCI Express? x16 Graphics bus is available for discrete graphics expansion or general purpose x8 or x4 PCI Express connectivity.
The Express-HLE features a single onboard Gigabit Ethernet port, four USB 3.0 ports and four USB 2.0 ports, and 4 SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
The ADLINK Express-HLE computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HLE is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Express-HL2
COM Express Basic Size Type 2 Module
ADLINK"s Express-HL and Express-HL2 COM Express modules with 4th generation Intel® i7/i5 processor (codename: Haswell) - up to 3.1GHZ quad core - and mobile Intel® QM87 Express chipset offer up to 16GB dual channel DDR3L SDRAM at 1600MHz. The Express-HL is a COM Express Type 6 module offering three independent displays via DDI interface, as well as seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1), four SATA III (6 Gb/s), Gigabit Ethernet, four USB 2.0, and four USB 3.0 interfaces. The Express-HL2 features the COM Express Type 2 pinout and offers 18/24-bit single/dual channel LVDS, Analog CRT, and a legacy 32 bit PCI bus, as well as PATA IDE interface.
The ADLINK Express-HL2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HL2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Express-CVC
COM Express Compact Size Type 2 Module
The Express-CVC is a low power, low cost, COM Express Type 2, COM.0 R2.1 module in Compact form factor that is specially designed to facilitate speedy development of semi custom designs. The COM Express standard embodies the convergence of the latest technology standards based on serial differential signaling such as PCI Express, USB 2.0, SATA and LVDS implemented on a compact size Computer on Module. Signals are brought out through two 220-pin board-to-board connectors that permit data transmission rates of up to 5GHz.
Mounting holes connect the module with a custom-made, application specific carrier boards which provide protection from shock and vibration.
The Express-CVCis positioned as an entry level COM Express module for systems that require a small footprint with dual core computing power and DDR3 memory. It is ideal for applications that require Floating Point CPU performance with average graphics support and moderate power consumption levels, such as Robotics, Industrial control and Data Communications. The module supports three different types of a 32nm process Intel® Atom™ processors : Intel® Atom™ N2600 processor with only 3.5W TDP (1M Cache, 1.6 GHz); the Intel® Atom™ N2800 processor (1M Cache, 1.86 GHz) with 6.5W TDP; and the Intel® Atom™ D2700 processor (1M Cache, 2.13 GHz) with 10W TDP.
The Intel® Atom™ processor integrates a graphics processing unit (GPU) has twice the performance as earlier generation Atom GPU and provides CRT and single channel LVDS. The Intel® Atom™ processors all support daul cores and Hyper-Threading Technology with 2-threads per core allowing the Express-CVC to provide excellent performance for multi-tasking or multi OS applications.
The Intel® NM10 PCH allows connection of up to three additional PCI Express x1 ports, while supporting the LAN controller on the 4th port. The module comes with a single onboard Gigabit Ethernet port and one SATA ports. It has legacy support for a single parallel IDE channel, 32-bit PCI and LPC.
The Express-CVC comes equipped with AMI UEFI BIOS supporting embedded features such as: Remote Console, CMOS backup in 16Mbit SPI BIOS, CPU and System Monitoring and Watchdog Timer.
The ADLINK Express-CVC computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-CVC is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Express-CB
COM Express® Basic Size Type 2 Module with Intel® Core i7/i5/i3 Processor
The Express-CB is a COM Express™ Type 2 module supporting the 64-bit IntelR Core™ i7 / i5 / i3 processor with CPU, memory controller, and graphics processor on the same chip. Based on the latest Mobile IntelR QM57 Express chipset, the Express-CB is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. Integrated graphics support includes features such as OpenGL 2.1, DirectX10, and IntelR Dynamic Video Memory Technology (IntelR DVMT 5.0). Graphics outputs include CRT, LVDS and Embedded DisplayPort. The Express-CB is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The Express-CB has dual stacked SODIMM sockets for up to 8 GB DDR3 memory. The IntelR Mobile QM57 Express chipset integrates CRT and single/dual-channel 18/24-bit LVDS display output. In addition to the onboard integrated graphics, a multiplexed PCI ExpressR Graphics x16 (PEG x16) bus is available for discrete graphics expansion, Embedded DisplayPort, or general purpose x8, x4 or x1 PCI ExpressR connectivity. The Express-CB features a single onboard Gigabit Ethernet port, up to eight USB 2.0 ports and four SATA 3 Gb/s ports with optional support for RAID 0/1/5/10. Additional storage interfaces include an optional SATA based Solid State Disk (8/16/32 GB), and a single IDE (PATA) channel. Legacy support is also provided for 32-bit PCI, LPC, SMBus and I2C. The module is equipped with an AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
Express-BL
COM Express Basic Size Type 6 Module
The Express-BL is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 5th Generation Intel® Core™ i7 and Xeon® E3-1200L v4 processors (codename "Broadwell") with Intel® QM87 Chipset. The Express-BL is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
The Express-BL features Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3L non-ECC dual-channel memory at 1333/1600 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity from the CPU to the Intel® QM87 Chipset.
Integrated Intel® Generation 8 Graphics includes features such as OpenGL 4.0, DirectX 11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option. The Express-BL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The Express-BL has dual stacked SODIMM sockets for up to 16 GB non-ECC type DDR3L memory. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.
The ADLINK Express-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-BL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
cExpress-HL
COM Express Compact Size Type 6 Module
The cExpress-HL is a COM Express COM.0 R2.1 Type 6 Compact size module supporting the 64-bit 4th Generation Intel Core i7/i5/3 ULT Processors with CPU (codename: Haswell), memory controller, graphics processor and I/O hub on the same chip. Leveraging the benefits provided by the Intel Core i7/i5/3 ULT System-on-Chip, the cExpress-HL is specifically designed for customers who need optimum processing and graphics performance with low power consumption in a long product life solution.
The cExpress-HL features the Intel® Core™ i7/i5/i3 processor supporting Intel® Hyper-Threading Technology (up to 2 cores, 4 threads) and up to 16 GB of DDR3L dual-channel memory at 1333/1600 MHz in dual stacked SODIMM sockets to provide excellent overall performance. Integrated Intel Generation 7.5 Graphics includes features such as OpenGL 3.1, DirectX 11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include dual-channel 18/24-bit LVDS and two DDI ports supporting HDMI / DVI / DisplayPort. The cExpress-HL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The cExpress-HL features a single onboard Gigabit Ethernet port, two USB 3.0 ports and six USB 2.0 ports, and 4 SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
The ADLINK cExpress-HL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The cExpress-HL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
SETO-1000
Extreme Outdoor Server
ADLINK’s new SETO-1000 is the first high-performance mobile edge computing (MEC) platform specifically designed for extreme environments and outdoor telecom/networking applications.
Based on the dual Intel® Xeon® E5-2400 v2 family of processors, the SETO-1000 MEC platform enables Telecom Equipment Manufacturers (TEMs) and application providers to deliver data center performance at the edge of the network. The SETO-1000 provides IT and cloud-computing capabilities within the Radio Access Network (RAN) in close proximity to mobile subscribers. This offers a service environment characterized by proximity, ultra-low latency, and high-bandwidth that allows content, services, and applications to be accelerated, maintaining a customer’s high-level Quality of Experience (QoE).
The SETO-1000 mobile edge computing platform provides computing resources, storage capacity, connectivity and access to user traffic and real-time radio and network information. This allows operators to offer context-related services that can differentiate and monetize the user experience. In addition, since the data is processed at the edge in the RAN environment, the SETO-1000 reduces backhaul costs and improves the infrastructure’s efficiency with more intelligent and optimized networks. And with the onset of network functions virtualization (NFV) infrastructure, having data center performance at the edge of networks can enable specific virtualized network functions (VNFs) closer to the consumer, improving QoE.
Attributes such as shock and vibration resistance, −40°C to +55°C operating temperature range, and IP65 water and dust ingress rating make the SETO-1000 an ideal solution for outdoor and extreme environments. The SETO-1000 can also utilize ADLINK’s application ready intelligent platform (ARiP) software, which includes PacketManager, remote management functions, and system management APIs for application developers. ARiPs enable customers to focus primarily on their application instead of the IoT platform building blocks required for cloud computing. The SETO-1000 reduces maintenance costs by eliminating fans and filters and offering worry-free, weather-resistant, high-speed connections for copper or fiber options.
ETX-CV
ETX Module
The ETX-CV is an ETX v3.02 compliant module specially designed to facilitate speedy development of semi custom designs. ETX is an open standard that targets the market for embedded OEM projects. An ETX core combined with a custom made carrier board represents a value solution that allows OEM customers to get to the market fast. The new ETX v3.02 specification adds SATA support to ETX in the form of two connectors on the module itself, leaving the ETX board-to-board interface 100% compatible with baseboards designed under the earlier ETX v2.xx specification.
The ETX-CV is positioned as an entry level ETX module for generic systems but also for systems requiring a full set of graphics features. The module comes with integrated support for high VGA up to 1920×1200 resolution (WUXGA), single/dual channel 18/24-bit LVDS and onboard DisplayPort connector.
The ETX-CV conforms to the latest ETX® 3.02 specification and provides two additional onboard SATA connectors while maintaining full backward compatibility with earlier ETX® standards.
Operating system support includes Windows XP, Windows XP Embedded, Windows 7, WinCE,and Linux. Primary focus is for applications in Medical Diagnostics and Imaging, Gaming, Industrial Automation, Test and Measurement, POS, and Industrial Control.
The dual-core Intel® Atom™ Processor N2000 and D2000 Series on the ETX-CV replaces the previous generation Intel® Atom™ processors N4xx/N5xx. Although much smaller in size, Intel® Atom™ processors share the same architecture as Intel® Core™2 Duo processors and additionally support Intel® Hyper-Threading Technology, allowing more than one code thread to be executed at the same time on a single core. The ETX-CV’s thermal design and powerful CPU core allow it to provide the same or even better performance than earlier generation modules at a more modest power consumption.
The ETX-CV supports up to 4 GB of DDR3 memory on a single SODIMM, incorporates an Intel 10/100BASE-T Ethernet controller, and provides dual channel IDE, two channels SATA, four USB 2.0 ports, two serial ports, one parallel port shared with floppy, one PS/2 keyboard/mouse interface and HD audio.
The ETX-CV fully supports PCI and legacy ISA based on high speed PCI/ISA bridge and is equipped with an AMI Aptio BIOS supporting embedded features such as Remote Console, CMOS backup for battery-less operation, CPU and System Monitoring and Watchdog Timer.
