M-Max HalfRack Chassis

Rugged 19/2” Rackmount Conduction-Cooled Enclosures Family for Computer Systems
  • Details
  • Specification
  • IP66-rated dust and moisture protection
  • Configurable front panel
  • Shock handling up to 40g, vibration up to 2.5g (for typical system)
  • Operating temperature: -40 to +70 °C (for typical system)

The M-Max HalfRack Chassis is 19/2″ form-factor rackmount conduction-cooled enclosures family for rugged computer systems development. The fully-ruggedized 19/2"-type aluminum chassis is fanless and uses natural convection and conduction cooling in accordance with MIL-STD-810 standards.

Versatile mechanical design of the enclosure allows to combine several systems into one assembly side by side or by stacking, mount them on a flat surface or into a 19″ rack using appropriate mounting parts. Thereby providing reliable operation in tough environments.

Technical specifications
Material: Aluminum (enclosure)
Steel (mounting brackets)
Versions: Height: 1U, 3U
Length: 200 mm, 280 mm
optional: 160 mm, 320 mm
Max heat dissipation: From 25W (1U) to 90W (3U)
Power subsystem (HalfRack 1U): +5 V @ 8 A, +12 V @ 5 A, +3.3 V @ 1 A
Power: +9 to +36 V DC (isolated) or +18 to +75 V DC (isolated)
Complies with MIL-STD-704F
AC adapter ~100 to 240 V (optional)
Connectors: 1x D38999 (Power)
Weight: From 1800 g (1U, 200 mm)
to 4700 g (3U, 280 mm)
Dimensions (W x H x L): 220 x 44 x 200/280 mm (1U)
220 x 132 x 200/280 mm (3U)
PC/104 boards capacity: 1 (1U), 4 (3U)
Form factor: PC/104, 3.5”, COM Express

Environmental and physical specifications for typical system

Dust/Moisture: IP66
Operating Temperature: -40 to +70 °C @ 25W (1U)
-40 to +50 °C @ 90W (3U)
Humidity: Operating: 5 to 95 % at +25 °C, non-condensing
Vibration: Operating acceleration amplitude up to 2.5g
Shock: Maximum peak shock acceleration up to 40g
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