LEC-PX30
SMARC Short Size Module with Rockchip PX30 Quad-Core Arm Cortex A35
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- Rockchip PX30 with Quad-core Arm Cortex-A35
- 1GB or 2GB DDR3L at 1066/1333 MHz
- 3D Graphics over MIPI DSI 4 lanes or LVDS 24-bit
- Rugged operating temperature: -20°C to +85°C
LEC-PX30 based on power-efficient quad-core Arm Cortex-A35 SoC is a low-power, low-cost, entry-level, small-sized SMARC rev 2.0 module. For applications, such as IoT controllers, IoT gateways, wearable and mobile industrial devices, basic HMI, sensor concentrators, requiring good computing performance at low power consumption (1.5W — 5W) and Linux Yocto capability, LEC-PX30 is an ideal solution.
| Technical specifications | |
| CPU |
Rockchip PX30 with Quad-core ARM Cortex-A35 CPU TrustZone technology support ARMv8 Cryptography Extensions |
| Memory | 1GB or 2GB DDR3L at 1066/1333 MHz, memory down (non ECC) |
| L2 Cache | 256KB unified system L2 cache |
| IOT security |
Cryptographic co-processor with secure hardware-based key storage for sign-verify authentication provides Internet of Things (IoT) protected storage for up to 16 Keys, certificates or data ECDH: FIPS SP800-56A Elliptic Curve Diffie-Hellman NIST standard P256 elliptic curve support SHA-256 & HMAC hash including off-chip context save/restore AES-128: encrypt/decrypt, Galois field multiply for GCM |
| SEMA Board Controller | Voltage/current monitoring, boot configuration, logistics and forensic information, flat panel control, watchdog timer |
| Debug Header | 30-pin multipurpose flat cable connector for use with optional DB-30 debug module providing JTAG, BMC access, UART, power testpoints, diagnostic LEDs, power, reset, boot configuration |
| Video |
GPU Core: Mali-G31 Supports DirectX 11 FL9_3, OpenGLES 1.1/ 2.0 / 3.2, Vulkan 1.0, OpenCL 2.0 Full Profile Video decoding: H.264 up to 1080p@60fps, H.265/HEVC up to 1080p@60fps MPEG-4, ISO/IEC 14496-2, SP@L0-3, ASP@L0-5, up to 1080p@60fps VP8, up to 1080p@60fps Video Encoding: H.264 video encoder at BP/MP/HP@level 4.2 1920x1080@30fps, 1x 1080p@30fps or 2x 720p@30fps encoding |
| MIPI DSI | MIPI DSI 4 lanes at max. 1080p@60fps display output (default) |
| LVDS | LVDS single channel 24-bit at max. 1280x800@60fps (build option) |
| Camera |
MIPI CSI RX Interface - Compatible with the MIPI Alliance Interface specification v1.0 - Up to 4 data lanes, 1.0Gbps maximum data rate per lane - Supports MIPI-HS, MIPI-LP mode |
| Audio | Supports ES8316 codec for high performance and low power multi-bit delta-sigma audio ADC and DAC (located on carrier) |
| Dual Ethernet |
Primary LAN: MAC 10/100 Ethernet Controller on SoC Supports 10/100-Mbps data transfer rates, both full-duplex and half-duplex Secondary LAN: MAC/PHY 10/100 Ethernet Controller on LAN9514 via USB 2.0 Supports 10/100-Mbps data transfer rates, both full-duplex and half-duplex |
| Expansion Busses |
USB: 4x USB 2.0, 1x USB OTG UART: Two UART interfaces SER0 and SER2 (TX/X/CTS/RTS) 64-byte FIFO and support for 5-bit, 6-bit, 7-bit, 8-bit data transmit or receive CAN bus: Supports CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps SPI: 2x SPI (one occupied by SPI-to-CAN controller ) I2S: 2x I2S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support) I2C: Four I2C interfaces - Support for 7-bit and 10-bit address mode - Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus GPIO: 12x GPIO with interrupt, one GPIO with PWM |
| System Storage |
SDIO: 1x SDIO (4-bit) compatible with SD3.0, MMC ver. 4.51 eMMC: 16, 32 or 64 GB (build option) Compatible with eMMC specification 4.41, 4.51, 5.0 and 5.1 |
| Form Factor | SGET SMARC Specifications v2.0 |
| Dimension | SMARC short size module, 82mm x 50mm |
| Operating Systems |
Standard Support: Yocto Linux BSP, Debian Linux Extended Support (BSP): Android 8.1 (by request) |
|
Environmental and physical specifications |
|
|---|---|
| Operating Temperature |
Standard: 0°C to +60°C Rugged: -20°C to +85°C (optional) |
| Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| LEC-PX30-Q-1G-0G-CT | SMARC module with Rockchip PX30 Quad, with 1GB DDR3L, 0°C to 60°C |
| LEC‑PX30‑Q‑1G‑16G‑CT | SMARC module with Rockchip PX30 Quad, with 1GB DDR3L and 16 GB eMMC, 0°C to 60°C |
| LEC-PX30-Q-1G-16G-R | SMARC module with Rockchip PX30K Quad, with 1GB DDR3L and 16 GB eMMC, -20°C to 85°C |
| LEC-PX30-Q-2G-0G-CT | SMARC module with Rockchip PX30 Quad, with 2GB DDR3L and 0 GB eMMC, 0°C to 60°C |
| LEC‑PX30‑Q‑2G‑16G‑CT | SMARC module with Rockchip PX30 Quad, with 2GB DDR3L and 16 GB eMMC, 0°C to 60°C |
| LEC-PX30-Q-2G-16G-R | SMARC module with Rockchip PX30K Quad, with 2GB DDR3L and 16 GB eMMC, -20°C to 85°C |
| LEC‑PX30‑Q‑4G‑32G‑CT | SMARC module with Rockchip PX30 Quad, with 4GB DDR3L and 32 GB eMMC, 0°C to 60°C |
| LEC-PX30-Q-4G-32G-R | SMARC module with Rockchip PX30K Quad, with 4GB DDR3L and 32 GB eMMC, -20°C to 85°C |
| HTS-sPX30 | Heatspreader for LEC-PX30 |
| THS-sPX30 | Low profile passive heatsink for LEC-PX30 |
