LEC-IMX8M
SMARC Short Size Module with NXP i.MX 8M
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- Quad Arm Cortex-A53 and Cortex-M4
- 1/2/4GB DDR3L memory
- Full 4K UltraHD resolution HDMI 2.0a and dual channel LVDS
- Extreme Rugged operating temperature: -40°C to +85°C
The SMARC («Smart Mobility ARChitecture») is a versatile small form factor computer on Module definition targeting applications that require low power, low costs, and high performance.
The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones.
Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
| Technical specifications | |
| CPU |
Arm Quad Cortex-A53 core up to 1.5 GHz Arm Cortex-M4 core processor is for low-power processing |
| Memory | 1/2/4GB DDR3L memory down |
| L2 Cache | 32 kB I-cache, 32 kB D-cache (A53) & 16 kB I-cache, 16 kB D-cache (M4) |
| IOT security |
Cryptographic co-processor with secure hardware-based key storage Protected storage for up to 16 Keys, certificates or data ECDH: FIPS SP800-56A Elliptic Curve Diffie-Hellman NIST standard P256 elliptic curve support SHA-256 & HMAC hash including off-chip context save/restore AES-128: encrypt/decrypt, Galois field multiply for GCM |
| SEMA Board Controller | Voltage/current monitoring, boot configuration, logistics and forensic information, flat panel control, watchdog timer |
| Debug Header | 30-pin multipurpose flat cable connector for use with optional DB-30 debug module providing JTAG, BMC access, UART, power testpoints, diagnostic LEDs, power, reset, boot configuration |
| Video |
GPU: Vivante GC7000Lite 2D/3D 4 shaders, OpenGL ES 3.1, OpenCL 1.2, OpenGL 3.0, OpenVG and Vulkan Up to 4Kp60 UHD resolution VPU: HEVC/H.265, H.264, VP9 Decoder 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG, H.263 Decoder (no VPU support for iMX 8M Quad Lite version) |
| HDMI | HDMI 2.0a supporting 4K resolution (4096 x 2160 at 60Hz) |
| LVDS |
LVDS single/dual channel 24-bit MIPI DSI (optional) MIPI DSI 4 lanes at up to 1080p @60fps display output (build option) |
| Camera | 2x MIPI-CSI2 camera inputs: one 4-lane, one 2-lane |
| Audio | Supports ES8316 codec for high performance and low power multi-bit delta-sigma audio ADC and DAC (located on carrier) |
| Dual Ethernet | Primary: GbE Ethernet Controller with IEEE-1588 PTP (Precision Time Protocol). Supports 10/100/1000-Mbps data transfer rates, both full- and half-duplex Secondary: Intel i210 GbE controller with IEEE-1588 PTP (Precision Time Protocol). Supports 10/100/1000-Mbps data transfer rates, both full- and half-duplex |
| Expansion Busses |
PCIe: 2x PCI Express x1 Gen2.1 USB: 2x USB 3.0/2.0, 2x USB 2.0 and 1x USB 2.0 OTG UART: 3x UART interfaces: Tx/Rx/CTS/RTS (SER0) and Tx/Rx (SER1, SER3), 7- or 8-bit data words, 1 or 2 stop bits, programmable parity (even, odd, or none). Programmable baud rates up to 4 Mbps CAN: Supports CAN 2.0B only or mixed CAN 2.0B and CAN FB mode, data bit rate up to 8 Mbps SPI: 2x SPI I2S: 2x I2S interfaces with audio resolution from 16-bits to 32-bits, sample rate up to 192KHz I2C: 6x I2C interface. Supports 7-bit and 10-bit address mode. Software programmable clock frequency: 100 kbit/s in Standard-mode, 400 kbit/s in Fast-mode or 1 Mbit/s in Fast-mode Plus GPIO: 12x GPIO with interrupt, one GPIO with PWM |
| System Storage |
SDIO: 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 eMMC: 32 or 64 GB (build option) eMMC specification 4.41, 4.51, 5.0 |
| Form Factor | SGET SMARC Specifications 2.0 (2.1) |
| Dimension | SMARC short size module, 82 mm x 50 mm |
| Operating Systems | Yocto Linux BSP, Ubuntu 18.04 LTS BSP, Windows 10 IOT Core BSP, Android 8.1 (by request) |
|
Environmental and physical specifications |
|
|---|---|
| Operating Temperature |
Standard: 0°C to +60°C Extreme Rugged: -40°C to +85°C (optional) |
| Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| LEC-iMX8M-D-1G-0G-ER | SMARC module with NXP iMX 8M Dual Core A53, with 1GB DDR3L, -40°C to 85°C |
| LEC-iMX8M-D-1G-8G-CT | SMARC Short Size Module with Dual Core NXP i.MX8M, 1 GB DDR3L, 8 GB eMMC, 0°C to 60°C |
| LEC-iMX8M-D-1G-8G-ER | SMARC Short Size Module with Dual Core NXP i.MX8M, 1 GB DDR3L, 8 GB eMMC, 40°C to 85°C |
| LEC-iMX8M-Q-2G-16G-CT | SMARC module with NXP iMX 8M Quald Core A53, with 2GB DDR3L and 16 GB eMMC, 0°C to 60°C |
| LEC-iMX8M-Q-2G-16G-ER | SMARC module with NXP iMX 8M Quald Core A53, with 2GB DDR3L and 16 GB eMMC, -40°C to 85°C |
| LEC‑iMX8M‑Q‑4G‑32G‑CT | SMARC Short Size Module with Quad Core NXP i.MX8M, 4 GB DDR3L, 32 GB eMMC, 0°C to 60°C |
| LEC-iMX8M-Q-4G-32G-ER | SMARC Short Size Module with Quad Core NXP i.MX8M, 4 GB DDR3L, 32 GB eMMC, 40°C to 85°C |
| LEC‑iMX8M‑Q‑4G‑64G‑CT | SMARC module with NXP i.MX8M Quald Core A53, with 4GB DDR3L and 64 GB eMMC, 0°C to 60°C |
| LEC-iMX8M-Q-4G-64G-ER | SMARC module with NXP iMX 8M Quald Core A53, with 4GB DDR3L and 64 GB eMMC, -40°C to 85°C |
| LEC‑iMX8M‑QL‑2G‑16G‑CT | SMARC Short Size Module with QuadLite NXP i.MX8M, 2 GB DDR3L, 16 GB eMMC, 0°C to 60°C |
| LEC‑iMX8M‑QL‑2G‑16G‑ER | SMARC Short Size Module with QuadLite NXP i.MX8M, 2 GB DDR3L, 16 GB eMMC, 40°C to 85°C |
| HTS-siMX8M | Heatspreader for LEC-iMX8M |
| LEC-iMX8M-HS1 | Heat Spreader for LEC-iMX8M |
| LEC-iMX8M-HS2 | Integral passive heatsink for LEC-iMX8M |
