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LEC-AL

SMARC Short Size Module with Intel Atom E3900 Series, Pentium N4200 or Celeron N3350 Processor
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  • Specification
  • Order information
  • Dual or quad-core Intel Atom E3900 Series or Pentium N4200 or Celeron N3350 Processor SoC
  • Up to 8 GB DDR3L at 1867 MHz
  • 9th generation Intel graphics core architecture
  • Extreme Rugged operating temperature: -40°C to +85°C

The LEC-AL Computer-On-Module (COM) combines the SMARC 2.0 standard with the latest Intel Atom E-Series and Pentium and Celeron N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel’s industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.

The module primarily targets embedded intelligent systems used in several vertical market segments such as healthcare, industrial controllers and real-time systems, retail systems, edge IOT gateways, in-vehicle infotainment systems, printers, thin clients, industrial and ruggedized tablets, and many others. The LEC-AL supports contemporary, high-bandwidth interfaces such as Ultra HD HDMI, dual-channel LVDS, PCI Express Gen2, Gigabit Ethernet, USB 2.0/3.0, SATA Gen3, enhanced MIPI CSI camera, and a state-of-the-art HD Audio interface.

The module generates its own LVDS (18/24bit), TMDS, and Display Port ++ video signals using eDP and DDI output from the SoC. Two SPI Flash chips implement a fail-safe BIOS, allowing the user to boot the module even if current BIOS settings have corrupted the system. Under the management of the BMC chip (Board Management Controller), the SEMA utility (Smart Embedded Management Agent) provides system control, security, and failure protection— counting, monitoring, and measuring hardware and software events, and using the SMBus to send corrective commands to the SoC.

Technical specifications
CPU Intel Atom E3950, 4 cores, 2.0 GHz, 12 W TDP
Intel Atom E3940, 4 cores, 1.8 GHz, 9.5 W TDP
Intel Atom E3930, 2 cores, 1.8 GHz, 6.5 W TDP
Intel Pentium N4200, 4 cores, 2.5 GHz, 6W TDP
Intel Celeron N3350, 2 cores, 2.4 GHz, 6W TDP
Memory Up to 8 GB DDR3L at 1867 MT/s
Single/dual channel memory 1-2 64bit, non-ECC
Embedded BIOS AMI UEFI with CMOS backup in 8 MB SPI BIOS, Fast Boot support
Cache 2 MB L2 cache
SEMA Board Controller Supports: Voltage/Current monitoring, Power Sequencing, Logistics and Forensic Information, Flat Panel Control, I²C Bus Control, GPIO Control, User Flash, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control
Video 9th generation Intel graphics core architecture with up to 18 execution units
Supports three independent displays 2D and 3D graphics hardware acceleration
Support for DirectX 12, OpenGL 4.2, OpenCL 1.2
Video decode HW acceleration for H.265/HEVC, H.264, MPEG2, MVC, VC-1, WMV9, JPEG/MJPEG, VP8, VP9
Video encode HW acceleration for H.265/HEVC, H.264, MPEG2, MVC, JPEG/MJPEG, VP8, VP9 (resolution depends on operating system)
LVDS Dual channel LVDS (18/24-bit)
HDMI/DP++ HDMI up to 3840 x 2160 @ 30Hz
DP++ DP++ up to 4096 x 2160 @ 60Hz
Audio Intel HD Audio integrated in SoC
1x I²S and 1x HDA for audio codec on carrier
Ethernet Intel MAC/PHY:
1x Intel i210-IT or i210-AT Ethernet controller

Interface:
1x 10/100/1000 GbE, IEEE 1588 trigger signals
I/O Interfaces 4x PCIe x1 Gen2
1x USB 2.0 OTG, 5x USB 2.0 host, 2x USB 3.0 host
1x SATA 3.0 (6 Gbit/s)
1x SDIO 3.0 (4bit)
2x MIPI CSI camera (2L/4L)
1x SPI, 1x eSPI, 4x I²C, 4x UART, 1x SMBus, 1x LPC, 1x DB40
Onboard eMMC 5.0 (4-64 GByte)
12x GPIO (interrupt capable)
Power Standard Input: 3.0 V~5.25 V DC ±5%
Power States: C0-C6, S0, S3, S4, S5
Form Factor SMARC Specifications v2.0
Dimension SMARC short size module, 82mm x 50mm
Operating Systems Standard support: Windows 10 IOT Enterprise, Windows 10 IOT Core, Yocto Linux
Extended support: VxWorks, Android

Environmental and physical specifications

Operating Temperature Standard: 0°C to +60°C
Extreme Rugged: -40°C to +85°C
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
LEC‑AL-E3930-2G-8G-ER SMARC Short Size Module with Intel Atom E3930, dual core, 2 GB DDR3L, 8GB eMMC, -40°C to 85°C
LEC-AL-E3940-4G-ER SMARC Short Size Module with Intel Atom E3940, quad core, 4 GB DDR3L
LEC-AL-E3940-4G-32G-ER SMARC Short Size Module with Intel Atom E3940, quad core, 4GB DDR3L, 32GB eMMC, -40°C to 85°C
LEC-AL-E3940-8G-32G-ER SMARC Short Size Module with Intel Atom E3940, quad core, 8 GB DDR3L, 32GB eMMC, -40°C to 85°C
LEC‑AL‑N3350‑4G‑64G‑CT SMARC Short Size Module with Intel Celeron N3350, dual core, 4 GB DDR3L, 64GB eMMC, 0°C to 60°C
LEC-AL-E3950-8G-32G-ER SMARC Short Size Module with Intel Atom E3950, quad core, 8 GB DDR3L, 32 GB eMMC, -40°C to 85°C
LEC-AL-N3350-4G-8G-CT SMARC Short Size Module with Intel Celeron N3350, dual core, 4 GB DDR3L, 8GB eMMC, 0°C to 60°C
LEC‑AL‑N3350‑4G‑16G‑CT SMARC Short Size Module with Intel Celeron N3350, dual core, 4GB DDR3L, 16GB eMMC, 0°C to 60°C
LEC‑AL‑N4200‑8G‑32G‑CT SMARC Short Size Module with Intel Pentium N4200, quad core, 8 GB DDR3L, 32GB eMMC, 0°C to 60°C
LEC‑AL‑N4200‑8G‑64G‑CT SMARC Short Size Module with Intel Pentium N4200, quad core, 8 GB DDR3L, 64GB eMMC, 0°C to 60°C
LEC-AL-HS1 Heat spreader for LEC-AL-E3930/E3940/E3950
LEC-AL-HS2 Heat spreader for LEC-AL-N3350/N4200
LEC-AL-HS3 Active heatsink for LEC-AL
LEC-AL-HS4 Integral passive heatsink for LEC-AL-E3930/E3940/E3950
LEC-AL-HS5 Integral passive heatsink for LEC-AL-N3350/N4200
LEC-Starterkit 2.0 LEC-Starterkit with LEC-BASE 2.0 carrier, LVDS display, SD card and ATX power supply (without LEC module and cooling solution)
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