Express-KL2
COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel Xeon and Core Processors
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
- Single/dual channel 18/24-bit LVDS and VGA
- Six PCIe x1, one PCI, one PCIe x16 (muxed with DDI channel)
- Three SATA, one PATA, eight USB 2.0 and GbE
- Extreme Rugged Operating Temperature: -40°C to +85°C (selected SKUs)
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
| Technical specifications | |
| Processor |
Mobile 7th Generation Intel Xeon, and Core Processors - 14nm (formerly”Kaby Lake-H”) Xeon E3-1505M v6 3.0/4.0GHz (Turbo), 45W(35W cTDP) (4C/GT2) Xeon E3-1505L v6 2.2/3.0GHz (Turbo), 25W (4C/GT2) Core i7-7820EQ 3.0/3.7GHz (Turbo), 45W(35W cTDP) (4C/GT2) Core i5-7440EQ 2.9/3.6GHz (Turbo), 45W(35W cTDP) (4C/GT2) Core i5-7442EQ 2.1/2.9GHz (Turbo), 25W (4C/GT2) Core i3-7100E 2.9GHz (no Turbo), 35W (2C/GT2) Core i3-7102E 2.1GHz (no Turbo), 25W (2C/GT2) Supports: Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Device Protection Technology with Intel Secure Key, Intel TSXNI Note: Availability of features may vary between processor SKUs. |
| Memory |
2400 MHz DDR4 memory in dual stacked SODIMM sockets Note: Xeon with CM236 supports both ECC and non-ECC memory (Core i3 available with MOQ) |
| Embedded BIOS | AMI EFI with CMOS backup in 16MB SPI BIOS with Intel AMT 11 support (depends on CPU/PCH) |
| Cache |
8MB for Xeon/Core i7 6MB for Core i5 3MB for Core i3 2MB for Celeron |
| PCH |
CM238 (supports ECC and non-ECC memory and Intel AMT) QM175 (supports Intel AMT ) HM175 (no Intel AMT support) |
| Expansion Busses |
PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3, muxed with DDI channel, build option) 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5, supports x4, x2, x1 configurations 1 PCI bus LPC bus, SMBus (system), I2C (user) |
| SEMA Board Controller | Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS, opt. support), watchdog timer and fan control |
| Debug Headers | 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs |
| GPU Feature Support |
Intel Generation 9 Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of VGA, LVDS (or optional eDP), optional DisplayPort/HDMI outputs (DisplayPort/HDMI from DDI channel muxed with PEG port) Encode/transcode HD content Playback of high definition content including Blu-ray Disc Playback of Blu-ray Disc 3D content using HDMI (1.4a spec compliant with 3D) DirectX Video Acceleration (DXVA) support for accelerated video processing HEVC/H.265, H.264, M/JPEG, MPEG2, VC1, WMV9, VP8/VP9 HW decode HEVC/H.265, M/JPEG, MPEG2 HW encode Advanced Scheduler 2.0, 1.0, XPDM support DirectX 12, DirectX 11.3, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL up to 4.4, OpenCL up to 2.1 support |
| Digital Display Interface |
DDI1/2 are muxed with PEG port, build option feature, supporting DisplayPort 1.2, HDMI 1.4, DVI Notes: DP1.2: max. resolution 4096x2304 @ 60Hz, 24bpp HDMI 1.4: max. resolution 4096x2160 @ 24Hz, 24bpp |
| VGA | VGA support from DP-to-VGA IC |
| LVDS | Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200@60Hz in dual mode) |
| eDP | 4 lane support optional, in place of LVDS (build option, max. resolution 4096x2304 @60Hz, 24bpp) |
| Ethernet |
MAC integrated in QM170/HM170/CM236 Chipset Intel® I219LM/V with AMT 11.0 support (only LM version supports AMT) 10/100/1000 GbE connection |
| Multi I/O and Storage |
USB: 8x USB 2.0 (USB 0-7) SATA: 3x SATA 6Gb/s (SATA 0,1,2) Max. 4x SATA without PATA feature, build option IDE (PATA): SATA-to-PATA IC on SATA port 3, Master only GPIO/SD: 4x GPO and 4x GPI (GPI with interrupt) |
| Super I/O | Supported on carrier if needed (standard support for W83627DHG-P) |
| TPM |
Chipset: Infineon Type: TPM 2.0 |
| Power |
Standard Input: ATX: 12V±5%, 5Vsb ±5% or AT: 12V±5% Wide Input: ATX: 8.5-20V, 5Vsb ±5%; AT: 8.5-20V Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving |
| Operating Systems |
Standard Support Windows 10 (64-bit), Linux (64-bit), VxWorks Extended Support (BSP) Linux 64-bit, VxWorks |
| Form Factor | PICMG COM.0, Rev 2.1 Type 2 |
| Dimension | Basic size: 125 mm x 95 mm |
|
Environmental and physical specifications |
|
|---|---|
| Operating temperature |
Standard: 0°C to 60°C Extreme Rugged: -40°C to +85°C (selected SKUs, by project basis) |
| Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| Express‑KL2‑i7‑7820EQ | Basic Size COM Express Type 2 module with Intel Core i7 - 7820EQ and GT2 level graphics, QM175 chipset |
| Express‑KL2‑i5‑7440EQ | Basic Size COM Express Type 2 module with Intel Core i5 - 7440EQ and GT2 level graphics, QM175 chipset |
| Express-KL2-i3-7100E | Basic Size COM Express Type 2 module with Intel Core i3 - 7100E and GT2 level graphics, HM175 chipset |
| HTS-SL2-B | Heatspreader for Express-SL2 with threaded standoffs for bottom mounting |
| THS-SL2-B | Low profile heatsink for Express-SL2 with threaded standoffs for bottom mounting |
| THSH-SL2-B | High profile heatsink for Express-SL2 with threaded standoffs for bottom mounting |
| THSF-SL2-B |
High profile heatsink for Express-SL2 with threaded standoffs for top mounting Note: Express-SL2 and Express-KL2 share the same thermal solutions. |
| COM Express Type 2 Starter Kit | A starter kit for COM Express Type 2 module |
