The Express-BE is a COM ExpressR COM.0 R2.1 Type 6 module supporting AMD R-Series APU (codename: Bald Eagle) with A77E Fusion Controller Hub. The Express-BE is specifically designed for customers who need excellent graphics performance and high-level processing performance with low power consumption in a long product life solution. The Express-BE features AMD Bald Eagle APU supporting Heterogeneous System Architecture (HSA) and non-ECC type DDR3L dual-channel memory at 1333/1600 MHz to provide excellent overall performance.
Integrated AMD Radeon™ HD 9000 Graphics includes features such as OpenGL 4.2, DirectX 11.1, OpenCL 1.2, OpenGLES 2.0, OpenCV support for H.264, MPEG2, VC1, MPEG4, WMV9, MVC hardware decode. Graphics outputs include dual-channel 18/24-bit LVDS, DDI ports supporting HDMI / DVI / DisplayPort. In addition, up to four independent displays are supported. The Express-BE is specifically designed for customers with high-performance processing and excellent graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The Express-BE has dual stacked SODIMM sockets for up to 16 GB non-ECC type DDR3L memory. In addition to the onboard integrated graphics, a multiplexed PCI ExpressR x16 Graphics bus is available for discrete graphics expansion.
The Express-BE features a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
Technical specifications | |
Core System |
|
---|---|
CPU |
AMD® Embedded R-Series APU RX-427BB 2.7GHz (3.6GHz boost), 35W (4C/8CU) RX-425BB 2.5GHz (3.4GHz boost), 35W (4C/6CU) RX-225FB 2.2GHz (3.0GHz boost), 17W (2C/3CU) |
Memory | Dual Channel non-ECC 1600/1333 MHz DDR3L memory up to 16GB in dual SODIMM socket |
Embedded BIOS | AMI EFI with CMOS backup in 8MB SPI BIOS |
Expansion Busses |
PCI Express x16 (Gen3) or 2x8 or 1x8 plus 1x4 6 PCI Express x1 (AB): lanes 0/1/2/3/4/5 1 PCI Express x1 (CD): lane 6 LPC bus, SMBus (system), I2C (user) |
SEMA Board Controller | Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control |
Debug Headers | 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs |
Video |
|
GPU Feature Support |
AMD® Radeon HD9000, supports 4 independent and simultaneous display combinations of DisplayPort, HDMI, LVDS monitors HW acceleration decoder (UVD4.2), supporting H.264, MPEG2, VC-1, MPEG4 (DivX), WMV9, MVC HW acceleration encoder (UVD4.2), supporting video conferencing, wireless display, H.264, SVC Windows 8, Windows 7, Linux OS support DirectX 11.1, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.2 support OpenCL 1.2, OpenGLES 2.0, OpenCV support AMD® Eyefinity support |
Digital Display Interface | DDI1/2/3 supporting DisplayPort / HDMI / DVI |
LVDS | Single/dual channel 18/24-bit LVDS from eDP (two lanes) |
Audio |
|
Chipset | AMD® Audio Coprocessor integrated in R-Series APU |
Audio Codec | Located on carrier Express-BASE6 (ALC886 standard supported) |
Ethernet |
|
Intel MAC/PHY | Intel® i210LM (MAC/PHY) Ethernet controller |
Interface | 10/100/1000 BASE-T connection |
I/O Interfaces |
|
USB | 4x USB 3.1 (USB 0, 1, 2, 3) and 4x USB 2.0 (USB 4, 5, 6, 7) |
SATA | Four ports SATA 6Gb/s (SATA0,1,2,3) |
Serial | 2 UART ports COM1/2 with console redirection |
GPIO | 4 GPO and 4 GPI |
Super I/O | Supported on carrier if needed (standard support for W83627DHG-P) |
TPM |
|
Chipset | Atmel AT97SC3204 |
Type | TPM 1.2 |
Power |
|
Standard Input | ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5% |
Wide Input | ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V |
Management | ACPI 4.0 compliant, Smart Battery support |
Power States | C0, C1, C1E, C6, CC6, S0, S3, S5 , S5 ECO mode (Wake on USB S3, WOL S3/S5) |
ECO mode | Supports deep S5 mode for power saving |
Other |
|
Form Factor | PICMG COM.0: Rev 2.1 Type 6 |
Dimension | Basic size: 125 mm x 95 mm |
Operating Systems |
Standard Support: Windows 7/8 32/64-bit, Linux 32/64-bit Extended Support (BSP): WES7/8, Linux 32/64-bit |
Environmental and physical specifications |
|
Operating temperature | Standard: 0°C to +60°C |
Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
Shock and Vibration | IEC 60068-2-64 and IEC-60068-2-27 |
HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
Model | Description |
Express‑BE‑RX‑427BB | COM Express type 6 Module with 4C AMD. Bald eagle RX-427BB APU at 2.7GHz with A77E PCH |
Express-BE-RX-425BB | COM Express type 6 Module with 4C AMD. Bald eagle RX-425BB APU at 2.5GHz with A77E PCH |
Express-BE-RX-225FB | COM Express type 6 Module with 2C AMD. Bald eagle RX-225FB APU at 2.2GHz with A77E PCH |
Starterkit-COM Express 6 PLUS | COM Express formfactor starterkitwith Express-BASE6 board,power supply, and accessory kit(order COM Express module,memory and thermal solution separately!) |
HTS-BE-B | Heatspreader for Express-BE with threaded standoffs for bottom mounting |
THS-BE-BL | Low profile heatsink for Express-BE with through hole standoffs for bottom mounting |
THSH-BE-BL | High profile heatsink for Express-BE with threaded standoffs for bottom mounting |
THSF-BE-B | High performance heatsink with fan Express-BE with threaded standoffs for bottom mounting |
HTS-BE-BT | Heatspreader for Express-BE with threaded standoffs for top mounting |
THS-BE-BTL | Low profile heatsink for Express-BE with through hole standoffs for top mounting |