COM Express Mini module delivers high performance on a small footprint, which features a 55×84 mm size. It is ideal for space-limited, power-saving, and mobile applications. DFI’s ultra-small modules are available with COM Express pin-out Type 10.
Technical specifications | |
System |
|
---|---|
Processor | Intel Atom x6000 series and Intel Celeron and Pentium N & J series processors |
Memory |
LPDDR4X up to 16GB Dual Channel LPDDR4X 3733MHz/4267MHz which depends on processor *Note1: 8GB/16GB supported by project basis. *Note2: In-band ECC (IBECC) with normal memory chip support on selected ATOM x6000 series SKUs. IBECC can set enabled or disabled in BIOS setup menu. |
BIOS | AMI SPI 256Mbit |
Graphics |
|
Controller | Intel HD Graphics |
Feature |
OpenGL 5.0, DirectX 12, OpenCL 2.1 HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, MVC |
Display |
1x DDI 1x LVDS/eDP LVDS: single channel 24-bit, resolution up to 1920x1200 @ 60Hz eDP: resolution up to 4096x2160 @ 60Hz HDMI: resolution up to 4096x2160 @ 30Hz DP++: resolution up to 4096x2160 @ 60Hz, 3840x2160 @60Hz |
Dual Displays | DDI + LVDS/eDP |
Expansion |
|
Interface |
4x PCIe x1 (Gen 3) 1x SD/SDIO (available upon request) 1x I2C 1x SMBus 1x LPC 1x Speaker 1x SD 3.0 1x SPI 2x UART (TX/RX) |
Audio |
|
Interface | HD Audio |
Ethernet |
|
Controller | 1x Intel I225-IT / I225-LM (10/100/1000Mbps/2.5Gbps) |
I/O |
|
USB |
2x USB 3.1 8x USB 2.0 |
SATA | 2x SATA 3.0 (up to 6Gb/s) |
eMMC | 1x 8GB/16GB/32GB/64GB/128GB eMMC 5.1 (available upon request) |
DIO | 1x 8-bit DIO |
Watchdog Timer |
|
Output & Interval | System Reset, programmable via software from 1 to 255 seconds |
Security |
|
TPM | dTPM or fTPM (Optional) |
Power |
|
Type |
4.75V~20V, 5VSB, VCC_RTC (ATX mode) 4.75V~20V, VCC_RTC (AT mode) |
OS Support |
|
OS Support | Windows 10 IoT Enterprise 64-bit, Linux |
Mechanical |
|
Dimensions | COM Express Mini 84mm (3.3") x 55mm (2.16") |
Compliance | PICMG COM Express® R3.0, Type 10 |
Environmental and physical specifications |
|
Temperature |
Operating: -5 to 65°C, -40 to 85°C Storage: -40 to 85°C |
Humidity |
Operating: 5 to 90% RH Storage: 5 to 90% RH |
Certifications | CE, FCC |
Model | Description |
770‑EHL9A21‑000G | Intel Atom x6425RE, LPDDR4 16GB on board, eMMC 64GB, LVDS, DIO, TPM 2.0, -40 to 85°C |
770‑EHL9A21‑100G | Intel Atom x6414RE, LPDDR4 16GB on board, eMMC 64GB, LVDS, DIO, -40 to 85°C |
770‑EHL9A21‑200G | Intel Atom x6212RE, LPDDR4 8GB on board, eMMC 64GB, LVDS, DIO, -40 to 85°C |
770‑EHL9A21‑300G | Intel Atom J6426, LPDDR4 8GB on board, eMMC 64GB, LVDS, DIO, -5 to 65°C |
770‑EHL9A21‑400G | Intel Atom N6211, LPDDR4 8GB on board, eMMC 64GB, eDP, SDIO, -5 to 65°C |
770‑EHL9A21‑500G | Intel Atom x6425RE, LPDDR4 8GB on board, eMMC 64GB, LVDS, DIO, TPM 2.0, -40 to 85°C |
A71-808341-010G | Heat spreader for IHS |
A71-808341-020G | Heat spreader for BARE-DIE CPU |
770-COM104-000G | COM100-B carrier board kit |
770-CM3351-000G | COM335 carrier board kit |