MicroMax's Solutions
MicroMax's Solutions
MicroMax's Solutions
EPS-12002L
Compact 12+2 Port Managed Ethernet Switch
Main features:
Rugged Ethernet switch for vehicle and other harsh environment applications
12 gigabit Ethernet ports for twisted pair connections
2 1/2.5/5/10G SFP+ sockets for fiber or copper transceivers
All ports feature non-blocking wire-speed performance
Layer 2+ switching and Layer 3 routing software available
IEEE 1588 PTP support available
Software customization and branding available
Rugged design with latching connectors
-40 to +85°C operating temperature
5.3×2.2″ / 136×55mm
Heat sink and heat spreader thermal options
The EPS-12002L is a compact managed rugged Ethernet switch based on Diamond’s EPSM-10GX Ethernet switch module. The switch consists of the EPSM-10GX module mounted on a carrier board that provides power, magnetics, and connectors, along with a heat sink or heat spreader.
EPS-12002L provides 12x 10/100/1000Mbps copper ports and 2x 1/2.5/5/10Gbps SFP+ sockets for fiber or copper transceivers. EPS-12002L is ideal for vehicle and industrial applications requiring a small form factor with gigabit Ethernet switching and fiber connectivity support.
Two software packages are available, Layer 2+ switching and Layer 3 routing/switching. All software features are manageable via a GUI web interface accessible over any port, as well as with a command language accessed via a built-in RS-232 port.
EPS-12002L is designed specifically to meet the challenges of vehicle and other rugged environments, with its −40/+85°C operating temperature range, latching I/O connectors, and MIL-STD-202G shock/vibration resistance. A 5-36V input power supply provides compatibility with a range of industrial and vehicle power supplies.
Embedded Software
Two software packages are available: Layer 2+ switching and Layer 3 routing/switching. In addition, IEEE-1588 precision time protocol support is available with a minor modification to install a precision clock circuit on the board. All software features are manageable via a GUI web interface accessible over any port, as well as with a command language accessed via a built-in RS-232 port. Customer branding is available to put your logo / color scheme / part numbers on the GUI and serial interface.
The table below shows some of the more popular features available.
Layer 2+ software highlights include the following:
8K MAC addresses and 4K VLANs (IEEE 802.1Q)
8K IPv4 and IPv6 multicast group support
Jumbo frame support at all speeds
Flexible link aggregation support based on Layer-2 through Layer-4 information (IEEE 802.3ad)
Multicast and broadcast storm control, as well as flooding control
Rapid Spanning Tree protocol (RSTP) and MSTP
Multiple protocol support: IEEE 802.1d, IEEE 802.1w, IEEE 802.1s, and IEEE 802.1X
8 priorities and 8 QoS queues per port with scheduling
Layer3 software additional highlights:
Hardware- and software-based IPv6 L3 static routing
RFC 2328 OSPFv2 dynamic routing
IEEE 1588 precision time protocol (PTP)
RADIUS accounting
Port and Queue policers
Cable Kit
Cable Kit for EPS-12000-CM: 3x Quad Gigabit Ethernet cables, Power cable, Serial cable.
EPSM-12G2F
26-Port Miniature Rugged Managed Ethernet Switch Module
EPSM-12G2F is a managed Ethernet switch module in an ultra-compact 2.2″ x 3.3″ (55×84mm) size offering 24x 10/100/1000Mbps copper ports and 2x 1-2.5Gbps SFP ports. It supports an embedded software package offering a full suite of Layer 2 managed Ethernet switching capabilities.
The module is intended to be used on a carrier board to implement a complete Ethernet switching solution. The core Ethernet switching technology is almost fully encapsulated on the module; for many applications, only the «last inch» of magnetics and I/O connectors is required to complete the circuit, enabling easy development of custom form factor compact, rugged Ethernet switch solutions.
EPSM-12G2F offers compelling advantages over in-house designed Ethernet switches requiring mid-range software features:
Small size fits into robots, drones, and other applications where size and weight are critical
Rugged design and wide temperature capability are ideal for vehicle applications where high levels of shock and vibration are present
Off the shelf solution significantly reduces development time and risk
Built-in embedded software provides the most popular managed switch features, all configurable via web or serial port interfaces, eliminating the need for any software development
Embedded Software
EPSM-12G2F includes the feature-rich WebStaX Layer 2 managed Ethernet switch software. The table below shows some of the more popular features included:
8K MAC addresses and 4K VLANs (IEEE 802.1Q)
8K IPv4 and IPv6 multicast group support
Jumbo frame support at all speeds
Flexible link aggregation support based on Layer-2 through Layer-4 information (IEEE 802.3ad)
Multicast and broadcast storm control, as well as flooding control
Rapid Spanning Tree protocol (RSTP) and MSTP
Multiple protocol support: IEEE 802.1d, IEEE 802.1w, IEEE 802.1s, and IEEE 802.1X
8 priorities and 8 QoS queues per port with scheduling
Cooling Options
Two cooling accessory options are available: A heat sink provides convection cooling in a low profile, while a heat spreader provides improved conduction cooling for superior high temperature performance in applications where physical contact with the system enclosure is available.
Development Support
A design guide is available with circuit details and other technical information necessary to design a carrier board around the EPSM-12G2F. A development kit is also available including:
A technical design package (schematics, PCB layout, and Bill of Materials) of the EPS-24G4X carrier board, featuring support for 12 1G ports from the module, PHY for 12 additional 1G ports, dual SFP sockets, LED control logic, and power supply circuit
CPLD code for status LED control logic
A complete EPS-24G4X switch with the EPSM-12G2F module installed
A cable kit
Free custom branding of the embedded software (logo / color / title only; custom configurations are extra charge)
Geode-JSP
Quick-Ship Easy-Expansion Rugged Systems
Geode-JSP offers easy customization and quick availability for rugged computers due to its novel architecture that includes pre-integrated expansion connectors for easy addition of I/O, plus the use of COM Express modules to support flexible CPU choices. With Geode-JSP you can add up to 3 I/O boards in the system without requiring any change to the enclosure or cabling. The elimination of custom enclosure and cabling design effort dramatically reduces up-front costs and delivery times, and the resulting use of common components across multiple product configurations helps keep production costs down and facilitates the production of small quantities for pilot or small-run programs.
A MIL-grade power supply with MIL-STD-461, −704, and −1275 compatibility and wide input range is available with both isolated and non-isolated configurations. For cost and weight reduction, a MIL-STD-461 filter circuit can be built right into the connector board, eliminating the separate power supply.
The COM is thermally coupled to the top surface of the enclosure. The filtered power supply is thermally coupled to the bottom surface of the enclosure. The entire system is housed in a rugged 3-part enclosure that eliminates all T joints and includes seals at all joints to ensure IP67 compliance.
Geode-JSP is based on Diamond’s Jasper COM Express carrier board featuring a high level of I/O as well as multiple sockets for I/O expansion. The optional integrated data acquisition circuit provides high-accuracy analog I/O with autocalibration and programming library support. Dual minicard sockets and a PCIe/104 socket with PCIe x1 and x16 links (depending on the installed COM) enable feature upgrade with the widest range of I/O modules, from low-cost minicards up to high-performance graphics and 10Gb Ethernet, all without modifying the case or cables.
Jasper
Rugged COM Express Type 6 Carrier Board and SBC with Rich I/O and Expansion
Jasper is a COM Express carrier board and SBC for Type 6 Basic (125×95mm) and Compact (95×95mm) modules. It is designed for applications that require ruggedness, a high level of I/O, or extended product lifetime.
Notable features of Jasper include:
Rugged mechanical design with thicker PCB and latching connectors
Wide temperature operation — up to −40 to +85C (depending on the installed COM)
Built-in 16-bit data acquisition circuit with autocalibration
Dual minicard sockets with PCIe and USB interfaces
Dual M.2 sockets for flash memory and network connectivity
PCIe/104 expansion socket supporting x16 and x1 links
Jasper is available as a carrier board alone, for user integration with a COM of your choice, or as a ready to run «single-board computer» with an 11th generation Intel Xeon/Core i7 processor COM installed. Both Windows and Linux OS support are standard, while other OS support is available upon request.
Flexible Design to Fit Any Application
The most popular I/O on Jasper is provided on a single row of connectors along the front edge of the PCB. This arrangement supports dual connection modes. First Jasper can be used with traditional cables, with each cable providing a positive locking feature for increased shock and vibration resistance. Secondly the single row of connectors makes it easy to design and build I/O connector boards that match the end application’s exact requirements. For example a connector board with commercial connectors (RJ-45, USB type A, etc.) or MIL-DTL-38999 rugged circuit connectors can be plugged directly into the Jasper I/O connectors to create a «cable-free» solution. Such a connector board can dramatically reduce assembly time and cost for the end system.
Rugged design
Jasper was designed from the ground up with a comprehensive set of features to meet the challenges of rugged environments and applications:
The 50% thicker PCB increases rigidity and improves reliability of fine pitch and high-ball-count BGA solder joints
Almost all I/O connectors are positive latching (not friction lock) for increased ruggedness
A bottom-side heat spreader provides more efficient cooling than a traditional heat sink
All components are rated and/or tested to ensure reliable −40 to +85 o C operation
Thermal Dissipation
Jasper supports installation of the COM and its heat spreader on the bottom side of the carrier. This enables more efficient mounting and heat dissipation, since the COM’s heat is directly coupled to the enclosure body instead of relying on a top-side heat sink to dissipate heat into the air inside. Jasper’s mounting plate surrounds the COM heat spreader to provide mounting stability for the entire board assembly.
I/O Expansion
Jasper includes dual PCIe minicard sockets with both PCIe and USB interfaces, supporting a wide range of I/O and communications/networking modules from Diamond as well as third party vendors. It includes an M.2 E key socket for installation of wifi and other networking modules. The PCIe/104 socket enables use with PCIe/104 Type 1 I/O modules using x1, x4, x8, and x16 PCIe links (depending on the capability of the installed COM) as well as PCIe/104 OneBank modules using the x1 lanes on the first connector bank.
Cable Kit
The Jasper cable kit includes cables for all I/O and features on the board. All cables except for SATA have positive latching feature for resistance to shock and vibration.
Osbourne
Carrier and Dev Kit for NVIDIA Jetson AGX Orin
Osbourne is a versatile carrier board for the NVIDIA Jetson AGX Orin high-performance GPU module. It provides access to all I/O features of the Orin module and includes numerous sockets for I/O expansion. Osbourne has been designed to be used in almost any application ranging from commercial to industrial to airborne to rugged military use.
Key highlights of Osbourne include:
Industry-standard camera adapter socket for use with a wide range of CSI, GMSL, and other cameras
10Gb Ethernet + 1GB Ethernet ports
Wide temperature operation — matching the range of the Orin module
Dual minicard sockets with PCIe and USB interfaces
Dual M.2 sockets for flash memory (M key 2242/2280) and network connectivity (E key 2230)
I/O concentrator connector enables use with standard and custom I/O breakout boards
Osbourne is available as a carrier board alone or with an Orin module and fan sink installed and ready for use. A Linux OS based on Nvidia L4T and customized to support all I/O on Osbourne is available for free download.
Flexible I/O Connector Design
All I/O on Osbourne is accessed through a single high-speed, high-density connector along the board edge. This decouples the board design from any specific I/O connector arrangement and frees you to select whatever I/O connector scheme you want. Standard connector boards are available for typical use cases, including a panel-mount connector board for installation in an enclosure and a breakout board for use with cables.
Panel I/O Board
The Panel I/O board provides the ability to install Osbourne directly into an enclosure without the use of cables. All I/O is provided on a series of commercial-style connectors designed to be mounted in an enclosure front panel. Panel I/O boards can also be designed with right-angle orientation.
I/O Expansion
Osbourne includes dual PCIe minicard sockets with both PCIe and USB interfaces, supporting a wide range of I/O and communications/networking modules from Diamond as well as third party vendors. It includes an M.2 E key socket for installation of WiFi and other networking modules.
Mass storage is provided with an M.2 2242/2280 NVME socket and a Micro-SD card socket.
JETBOX-Nano
Rugged, durable enclosure for NVIDIA Jetson Nano development kit
Ever since its introduction in March of 2019, the NVIDIA Jetson Nano computer-on-module has been capturing the hearts and minds of AI systems builders everywhere. JETBOX-nano™ is a low-cost enclosure for the Jetson Nano development kit. The all-steel enclosure provides a rugged, durable enclosure solution for the Jetson Nano that measures a compact 125mm x 95mm x 34mm (approx. 4.9×3.7×1.3 inches). The combination of the Jetson Nano development kit with the JETBOX-nano means users can deploy a professional quality NVIDIA Jetson system with almost 500 gigaFlops performance.
The NVIDIA Jetson Nano Development Kit provides plenty of I/O for makers, learners, and developers.
The JETBOX-Nano measures a compact 125mm x 95mm x 34mm (approx. 4.9×3.7×1.3 inches). Its 2-part design makes assembly quick and easy. In addition to the standard front-facing I/O connectors, the enclosure provides access to the serial port and camera flex cable port on the Nano development kit’s left side and the GPIO port on its right. A programming button on the rear enables easy software updates, and a DIN rail mount makes installation in end equipment easy.
JETBOX-nano comes as an easy to construct kit that includes everything needed to construct the durable, quality enclosure designed to house the NVIDIA Jetson Nano development kit:
Top and bottom enclosure pieces with assembly hardware
Rear programming button
DIN rail mounting bracket
Optional GPIO cable (-02 model)
Easy-to-follow instructions for building JETBOX-nano
The JETBOX-nano enclosure kit is available in two configurations: The basic model and a GPIO-enabled model that includes a GPIO feature connector on the right side. The Nano development kit is purchased separately and is readily available from online vendors. Contact us for options regarding availability of a fully-assembled, ready-to-run system including the Nano development kit pre-installed.
Saturn
Rugged Apollo Lake x7-E3950 SBC with Data Acquisition and PCIe/104 Expansion
Saturn combines a feature-rich Atom‑class processor‑based SBC with a professional-quality industrial analog and digital data acquisition subsystem and flexible I/O expansion in a single board designed for rugged applications.
Intel "Apollo Lake" x7-E3950 1.6GHz (burstable 2.0GHz) quad-core processor with 15-year lifecycle
4GB non-ECC or 8GB ECC RAM soldered down
Integrated professional-quality analog and digital data acquisition subsystem with software support
Bottom side heat spreader with integrated thermal pad provides efficient cooling and convenient mounting
Full −40 to +85ºC industrial operating temperature range
Thicker PCB and latching connectors increase resistance to shock and vibration
PCIe/104 OneBank expansion socket for industry-standard rugged I/O expansion
Minicard expansion socket for versatile low-cost I/O
Saturn was designed from the ground up with a comprehensive set of features to meet the challenges of rugged environments and applications:
Memory is soldered down to avoid problems that can occur with commercial style SODIMM type memory modules
The 50% thicker PCB increases rigidity and improves reliability of fine pitch and high-ball-count BGA solder joints
All I/O connectors are latching for increased ruggedness
A bottom-side heat spreader provides more efficient cooling than a traditional heat sink. Processor and memory chips are both thermally connected to the heat spreader. In addition the exterior surface features recessed thermal pads for improved thermal connectivity to the system enclosure.
All components are rated and/or tested to ensure reliable −40 to +85ºC operation
Integrated Data Acquisition
Saturn is a member of Diamond’s 2-in-1 series of SBCs with integrated data acquisition. For applications requiring precision analog I/O, a 2-in-1 SBC is an ideal choice because it reduces the number of boards in the system, resulting in a system that is smaller, lighter, lower cost, and easier to assemble and maintain. The features of the Saturn DAQ circuit surpass those found on most other embedded SBCs in both variety and quality, providing a comprehensive, professional quality subsystem backed with top of the line software support. «A» models include the full DAQ circuit with both analog and digital I/O features, while «D» models include only the digital I/O features.
Saturn’s data acquisition circuit features autocalibration, which maintains best accuracy of the A/D and D/A circuits regardless of time and temperature swings. Using the supplied Universal Driver software library, the circuit can be quickly calibrated to within +/-2LSB accuracy at any time, relative to the on-board precision reference voltage circuit.
The A/D circuit includes 16 single-ended / 8 differential analog input channels with programmable input ranges and a maximum aggregate sampling rate of 250KHz. A built-in programmable counter/timer supports accurate high-speed sampling with precise timing. The 2048-sample FIFO with programmable threshold ensures error-free sampling and enables you to tune the performance of the circuit to minimize interrupt processing overhead.
The D/A circuit consists of 4 16-bit D/A voltage outputs with independently programmable output ranges including 0-10V, +/-10V, 0-5V, and +/-5V. A 2048-sample waveform buffer is included to support arbitrary waveform generator functions on up to 4 channels simultaneously.
The digital I/O circuit consists of GPIO, counter/timers, and pulse-width modulators. The GPIO circuit provides 22 buffered digital I/O lines, consisting of one 8-bit port and 14 1-bit ports. Each port is individually programmable for input or output. The 1-bit direction controllable ports provide better matching of input and output quantities to each application. Jumper configuration enables selection of 5V/3.3V logic levels and pull-up or pull-down resistors on the digital I/O lines.
The 8 32-bit programmable counter/timers feature both up and down counting with clocking selectable from an external digital signal or the on-board 50MHz clock. Counters can be used for generating programmable output frequencies with programmable output pulse widths, counting external events, generating interrupts to the host processor at a programmable rate, and driving A/D sampling at precise frequencies with perfect timing between samples.
The circuit further includes 4 24-bit programmable pulse width modulators also driven by the on-board 50MHz clock. These feature programmable rate, duty cycle, and polarity, with real-time rate and duty cycle update capability.
Software Support
Diamond Systems’ Universal Driver software provides unmatched power and flexibility for embedded data acquisition programming with PC/104 and small form factor I/O boards. It provides flexible C-language programming support for Windows and Linux to control all data acquisition features on Saturn, as well as Diamond’s MiniCard data acquisition modules that can be used with Saturn.
A powerful and convenient graphical control panel provides instant, easy access to all data acquisition features on the board. It can be used for proof of concept, testing, and even system debugging.
I/O expansion
Saturn provides two sockets for the installation of I/O expansion modules:
A PCIe/104 OneBank I/O expansion socket provides 4 PCIe x1 lanes and 2 USB 2.0 ports to interface with hundreds of PCIe/104 I/O modules from vendors around the world. Only top side expansion is supported, since the bottom side of Saturn is covered by the heat spreader.
A full-size PCIe MiniCard socket supports both PCIe and USB minicards. Saturn supports Diamond’s complete line of PCIe MiniCards.
What is PCIe/104 OneBank™?
OneBank™ is the name given to the PCIe/104 standard that utilizes a more compact, cost effective connector to support rugged, high-speed I/O expansion. The original PCIe/104 connector features 3 «banks» of contacts. The 2nd and 3rd banks contain PCIe x8 / x16 signals that are not supported on Atom processors nor used by most I/O expansion modules. By eliminating these signals, a smaller and more cost effective connector can be used to provide compatibility with any PCIe/104 I/O module that uses a PCIe x1 or USB host connection, while freeing up precious PCB space for additional I/O or connectors. OneBank is an official expansion connector supported by the PC/104 Consortium (of which Diamond Systems was a founding member).
Mass storage
Saturn offers two options for mass storage:
An M.2 2242 size SATA socket is provided for onboard mass storage. Modules up to 1TB are available. This is the most common choice.
A standard 7-pin SATA connector is available for connecting a standard 2.5″ or other form factor hard drive. This connector can be used when higher capacity storage is needed. Diamond offers accessory board ACC-HDDMOUNT which allows a 2.5″ drive to be mounted on the PC/104 holes on Saturn.
Cable Kit
The Saturn cable kit includes all I/O cables needed for all I/O connectors on Saturn except the LCD data and backlight cables, which are customized for each individual application. Cables are normally sold as complete kits. Individual cables may be available in some cases or may be ordered with minimum order quantities; contact us for availability. Detailed drawings listing all components are provided to enable customers to build their own cables.
Development kits
Development kits are available to support quick project startup. Each kit includes the Saturn SBC, a cable kit, and a programmed 64GB flashdisk with a read-to-run installation of Windows 10 or Linux operating system, plus a backup USB memory device. Simply install the flashdisk, attach the cables, add your keyboard, mouse, and display, and connect power, and the board will boot into a fully functional OS.
Configuration files and instructions are provided to rebuild the OS with your application. The Linux kit includes all the tools needed to rebuild the OS. The Windows 10 kit includes a runtime license.
A software-only kit is available that consists of just the programmed flashdisk and backup USB memory device. This software kit is intended for customers who already have one or more Saturn SBCs. One software kit can be used on any number of Saturn boards. (Windows licensing requirements still apply.)
Midi
Box PC with wide temperature performance and abundant I/O
MIDI systems provide an efficient solution for customers seeking a Box PC with wide temperature performance and abundant I/O. MIDI systems feature expansion-ready front panels with removable cover plates to expose additional connector cutouts. The enclosure can easily accommodate up to two additional PC/104 style I/O modules or PCIe MiniCards. The cover plate provides ample cooling for Diamond’s rugged conduction-cooled SBCs. Table-top, wall mount, and DIN rail mounting options are all included.
MIDI systems are available in a variety of standard configurations based on Diamond’s Aries (Bay Trail x86), Venus, and Eagle / Eaglet (ARM) SBCs.
SabreNet-12000
Rugged 12-Port Managed Gigabit Ethernet Switch
SabreNet-12000 is a compact rugged switch featuring 12 ports of 10/100/1000Base-T managed Ethernet. The switch is based on Diamond’s EPS-12000 compact Ethernet board-level switch. The ports are arranged in groups of 4 and 8 on two MIL-DTL-38999 connectors.
The SabreNet-12000 includes embedded Layer 3 routing/switching software with optional IEEE1588 / PTP feature. The switch can be managed via a web interface on any of the ports as well as a local RS-232 port accessed on the 4-port connector.
SabreNet-12000 has passed MIL-STD-810G shock and vibration testing.
Power Supply Options
Two power and enclosure configurations are available:
Models numbered 1xx include a MIL-STD-461 power filter module and support an input voltage range of 7-34VDC. These units are housed in the short enclosure.
Models 2xx include a MIL grade isolated power supply based on Diamond’s JMM-7500, which provides compliance to MIL-STD-461, MIL-STD-704, and MIL-STD-1275 and supports an input range of 9-60VDC. These units are housed in the taller enclosure.
SabreCom-VNS
Rugged Mission Computers with Core i7 CPU and I/O Expandability
The SabreCom series of rugged mission computers brings a competitive level of price/performance to the market. These systems are based on Diamond’s line of rugged, I/O-rich single board computers. SabreCom-VNS is the standard model and is based on Diamond's Venus rugged SBC with 7th Generation Intel «Kaby Lake» Core i7 processor with a combination of features making it ideal for rugged environments. Latching I/O connectors, thicker PCB, soldered + ruggedized SODIMM memory, and integrated heat spreader / mounting plate make Venus the perfect platform for mid-to high-level CPU performance in a compact and affordable package.
SabreCom Venus is available in a standard configuration with competitive leadtime and without minimum order quantity or NRE charges. Customization with additional I/O modules and power supplies, as well as custom connectors and case designs, is available with moderate design fees and low minimum order quantities. Contact us to learn how Diamond is changing the game for cost-effective yet high-quality and high-reliability rugged computer systems and Ethernet switches.
Environmental Qualification
SabreCom systems have been tested and qualified to MIL-STD-202G shock and vibration levels to assure reliable performance in the most rugged vehicle applications. The sealed enclosure design features gaskets on all mating surfaces as well as all connector mounting screws to provide IP67 environmental protection. Unlike other rugged enclosures, the main body consists of a single block of aluminum milled to create a seamless 4-wall structure, eliminating the T joints that can be a source of leakage. All SabreCom systems are operational up to the full temperature range of the embedded SBC due to the efficient conduction cooling of the CPU directly to the top heat sink cover of the enclosure.
Mass storage
Mass storage of 256GB TLC technology is included as standard. Storage can be increased up to 1TB as an option using SATA DOM and mSATA modules. SLC technology is available.
Power supply
SabreCom systems are powered by Diamond’s rugged JMM-7500 power supply. This power supply features 80 watts output power with optional isolation and MIL-STD-461/704/1275 compliance.
Operating systems
Your choice of Linux or Windows 10 64-bit OS can be preloaded onto the flashdisk. Windows 10 OS features Diamond’s Power Loss Protection™ feature that survives repeated instant removal of power without requiring to wait for the normal Windows shutdown process.
