Back to results...

cExpress-BT2

COM Express Compact Size Type 2 Module
  • Details
  • Specification
  • Order information
  • Single, dual, Quad-core Intel® Atom™ or Celeron® Processor System-on-Chip
  • Up to 8GB Dual Channel DDR3L at 1333MHz
  • Two PCIe x1, and 32-bit PCI bus
  • Operating Temperature Standard: 0°C to +60°C Extreme Rugged™: -40°C to +85°C (optional, Atom™ E38xx series only)

The cExpress-BT2 is a COM Express COM.0 R2.1 Type 2 module supporting Intel Atom processor E3800 Series and Intel Celeron N2930/J1900 processor SoC (codename: Bay Trail).

The cExpress-BT2 is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

The cExpress-BT2 features Intel Atom processor E3800 and Intel Celeron N2930/J1900 processor supporting non-ECC type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Integrated Intel Gen7 HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1 and support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include DDI ports supporting HDMI/DVI/DisplayPort and single-channel 18/24-bit LVDS (eDP is optional). The cExpress-BT2 is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The cExpress-BT2 has soldered type non-ECC DDR3L memory for up to 4 GB. In addition, onboard eMCC memory (8/16/32GB) and SDIO signals are optionally supported.

The cExpress-BT2 features a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 3 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.

The ADLINK cExpress-BT2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The cExpress-BT2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Technical specifications

Core System

CPU Single, dual, quad-core Intel® Atom™ or Celeron® Processor
Atom™ E3845 1.91 GHz 542/792 Gfx (Turbo) 10W (4C/1333)
Atom™ E3827 1.75 GHz 542/792 Gfx (Turbo) 8W (2C/1333)
Atom™ E3826 1.46 GHz 533/667 Gfx (Turbo) 7W (2C/1066)
Atom™ E3825 1.33 GHz 533 Gfx (No Turbo) 6W (2C/1066)
Atom™ E3815 1.46 GHz 400 Gfx (No Turbo) 5W (1C/1066)
Celeron® N2930 1.83 GHz, 400/756 Gfx (Turbo) 7.5W (4C/1066)
Celeron® J1900 2 GHz, 688/792 Gfx (Turbo) 10W (4C/1333)

Supports: Single, dual or quad Out-of-Order Execution (OOE) processor cores, Intel® VT-x, Intel® SSE4.1 and SSE4.2, Intel® 64 architecture, IA 32-bit, PCLMULQDQ Instruction DRNG, Intel® Thermal Monitor (TM1 & TM2)

Note: Availability of features may vary between processor SKUs.
Memory Dual channel non-ECC 1333/1066 MHz DDR3L memory up to 8GB in dual stacked SODIMM sockets
Embedded BIOS AMI EFI with CMOS backup in 8MB SPI BIOS
Cache Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back data cache
2MB for E3845, N2920 and J1900
1MB for E3827, E3826 and E3825
512K for E3815
Expansion Busses 2 PCI Express x1 Gen 2 (AB): lanes 0/1
PCI Bus 33 MHz Rev. 2.3
LPC bus, SMBus (system) , I2C (user)
SEMA Board Controller Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control
Debug Headers 40-pin multipurpose flat cable connector
Note: Use in combination with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, Power Testpoints, Debug LEDs
60-pin XDP header for ICE debug of CPU/chipset

Video

GPU Feature Support 7th generation Intel® graphics core architecture with four execution units supporting two independent displays
3D graphics hardware acceleration
Supports for DirectX 11, OpenCL 1.1, OpenGL ES Halti/2.0/1.1, OGL 3.2
Video decode hardware acceleration including support for H.264, MPEG2, MVC, VC-1, WMV9 and VP8 formats
Video encode hardware acceleration including support for H.264, MPEG2 and MVC formats
VGA Analog VGA supporting resolutions of up to 2560 x 1600 x 24bpp @60
LVDS Single/dual channel 18/24-bit LVDS from eDP (two lanes)

Audio

Chipset Intel® HD Audio integrated in SoC
Audio Codec Located on carrier Express-BASE

Ethernet

Intel® MAC/PHY Intel® i210LM (MAC/PHY) Ethernet controller
Interface 10/100/1000 GbE connection

I/O Interfaces

USB 7x USB 1.1/2.0 (port 3~6 from USB hub)
SATA One SATA 3 Gb/s ports (optionally 2 ports: lose PATA)
PATA Single PATA IDE (Master only) through SATA to PATA IC
eMMC Optional soldered on-module bootable eMMC flash storage 8 to 32GB, eMMC feature may vary between OS
GPIO 4 GPO and 4 GPI
Super I/O On carrier if needed (standard support for W83627DHG-P)

TPM

Chipset Atmel AT97SC3204 (optional)
Type TPM 1.2

Power

Standard Input ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide Input ATX = 5~20 V / 5Vsb ±5% or AT = 5 ~20V
Management ACPI 4.0 compliant, Smart Battery support
Power States C0, C1, C1E, C4, C6 S0, S3, S4, S5 (Wake on USB S3/S4, WOL S3/S4/S5
ECO mode Supports deep S5 (ECO mode) for power saving

Other

Specification PICMG COM.0: Rev 2.1 Type 2
Form Factor Compact size: 95 mm x 95 mm
Operating Systems Standard Support: Windows 7/8 32/64-bit, Linux 32/64-bit
Extended Support (BSP): WES7/8, Linux, VxWorks 32/64-bit, WEC7 32-bit

Environmental and physical specifications

Operating Temperature Standard: 0°C to +60°C
Extreme Rugged™: -40°C to +85°C (optional, Atom™ E38xx series only)
Humidity 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Model Description
cExpress-BT2-E3845 Compact COM Express Type 2 module with Intel Atom E3845 at 1.91 GHz
cExpress-BT2-E3827 Compact COM Express Type 2 module with Intel Atom E3827 at 1.75 GHz
cExpress-BT2-E3826 Compact COM Express Type 2 module with Intel Atom E3826 at 1.46 GHz
cExpress‑BT2‑E3825 Compact COM Express Type 2 module with Intel Atom E3821 at 1.33 GHz
cExpress-BT2-E3815 Compact COM Express Type 2 module with Intel Atom E3815 at 1.46 GHz
cExpress‑BT2‑N2930 Compact COM Express Type 2 module with Intel Celeron N2930 at 1.83 GHz
cExpress-BT2-J1900 Compact COM Express Type 2 module with Intel Celeron J1900 at 2.00 GHz
Accessories
HTS-cBT2-B Heatspreader for cExpress-BT2 with threaded standoffs for bottom mounting
HTS-cBT2-BT Heatspreader for cExpress-BT2 with through hole standoffs for top mounting
THS-cBT2-B Low profile heatsink for cExpress-BT2 with threaded standoffs for bottom mounting
THSH-cBT2-B High profile heatsink for cExpress-BT2 with threaded standoffs for bottom mounting
THSF-cBT2-B High profile heatsink with Fan for cExpress-BT2 with threaded standoffs for bottom mounting
Type 2 Starter Kit Plus Starter kit for cExpress-BT2


Login / Registration
укажите почту
введите пароль
Forgot password?
By clicking «#SUBMIT_NAME»,
you agree to our Privacy Policy
Loading data...
Subscribe to our newsletter
specify your contacts

By clicking «#SUBMIT_NAME»,
you agree to our Privacy Policy

You have successfully subscribed
Now you can receive newsletters