MicroMax Granted Patent
February 22, 2012
New York, February 22, 2012, MicroMax announced today that they have received confirmation from the Patent Office granting a patent for the technology to extract excessive heat from electronic components working at high vibration.
MicroMax, developer and manufacturer of the M-MAX line of high performance rugged computers, has received a confirmation that the Patent Office has granted a patent for its technology to dissipate excessive heat from computer boards and other electronic devices working at high vibration. The final examination of the application was successful - "The claimed invention meets the criteria for patentability: novelty, inventive step and industrial applicability."
Sam Abarbanel, President of MicroMax stated "This technology was a product of our need to meet the exacting and stringent needs of our clients. We are thrilled to be awarded this patent as it is a testament to the caliber of our engineering staff."
The patented technology allows building high performance embedded systems when passive cooling under harsh conditions such as extreme temprerature ranges, high vibration and shock, water and dust protection as well as small dimension are a must. This technology has allowed MicroMax to create the unsurpassed M-Max 800 PR, a fully sealed 2.26Ghz Intel Core 2 Duo CPU system which operates at ambient temperatures from -40 to +55 °C, being highly vibration and shock resistant.
MicroMax specializes in the development of computer technologies for rugged applications which requires performance at extreme temperature ranges, high vibration, high humidity and high concentration of dust. We offer a line of M-Max's off-the-shelf systems as well as highly customized systems which could be tailored to very sophisticated customer requirements. The level of customization might include specialized interfaces, customer defined connectors as well installation of additional boards and their integration in the "heat-path" of the system.
MicroMax Computer Intelligence was founded in New York, USA, in 1979. It specializes in systems development and distribution of industrial computing and communication products, designing and manufacturing of embedded solutions for harsh environments.
