Aurora
Aurora 1.6GHz Atom Z530P PC/104 Single Board Computer Aurora is a rugged, single board computer (SBC) based on the 1.6GHz Intel Atom Z530P CPU and conforming to the compact, PC/104-sized, SUMIT-ISM form-factor. The SBC supports up to 2GB of DDR2 SO-DIMM SDRAM and provides high-resolution LVDS and SDVO graphics interfaces. Additional I/O ports include SATA, USB, serial, digital I/O, and Gigabit Ethernet. Flexible system expansion is based on industry-standard, stackable PC/104 (ISA) and SUMIT-A (PCIe) modules. A location is also provided for an optional on-board USB flashdisk. Aurora's power-efficient design leverages Intel's ultra-low-power (Menlow) silicon platform, consisting of the Atom Z5xx (Silverthorne) processors and US15W chipset (Poulsbo). These ICs are positioned on the bottom of the board, resulting in easy and efficient heat removal via a heatspreader for wide-temperature, fanless operation. Aurora is compatible with Linux, Windows XP, Windows Embedded Standard, Windows Embedded CE, and QNX. All necessary drivers are provided with the product.
Rhodeus
Rhodeus Low Power AMD Geode LX800 PC/104 CPU Module with CRT/LCD, LAN and CompactFlash Rhodeus is a fan-less PC/104 SBC which features the AMD Geode LX800 low power consumption processor running at 500MHz. It uses high speed DDR SDRAM providing maximum capacity at 1GB. Rhodeus offers fully integrated PC functionality with low power consumption which allows Rhodeus to operate in harsh environments where the airflow for heat dissipation is restricted and heat sinks or fans are unacceptable. Its ruggedability gives it the power to perform round-the-clock in unattended environments. Other advantages of Rhodeus includes high speed 10/100 Ethernet LAN and ample I/O interfaces, 2 serial ports, 2 USB 2.0 ports, parallel port for peripheral connection, 1 ATA-33 channel, Compact Flash Type-II socket, PC/104 expansion bus, LCD & CRT interface, floppy, and watchdog timer. Rhodeus has all the necessary features and expansion capability in 96 X 90 mm form factor, which makes it ideal for applications where space is limited but multiple I/O configurations are needed. Rhodeus supports Windows 2000, Windows XP, Windows CE 5.0, and Linux.
Helios
Helios 300MHz to 800MHz PC/104 Single Board Computer Helios is a low power, mid range performance PC/104 form factor single board computer combining a highly integrated CPU with Diamond Systems’ renowned high-accuracy data acquisition circuitry on a single board, reducing size and cost while increasing ruggedness. Helios utilizes a Vortex integrated single chip CPU operating at 300MHz or 800MHz and 128MB or 256MB of DRAM soldered on-board. Helios incorporates advanced features such as four USB 2.0 ports, an IDE hard drive interface, mounting capability for a solid state flashdisk up to 4GB, and CRT/LVDS LCD graphics. Helios also provides a 10/100Base-T Ethernet interface, two RS-232 serial ports, two RS-232/422/485 serial ports and legacy keyboard and mouse interfaces. Helios is extremely rugged, featuring on-board soldered DRAM and -40°C to +85°C fan-less operation. Optional hardwired jumpers and latching connectors are available for increased resistance to shock and vibration. Conformal coating is available as an extra cost option.
CMx-SLx
CMx-SLx PCI/104-Express Type 1 Single Board Computer with 6th Gen. Intel® Core™ Processor (formerly codenamed Skylake) The CMx-SLx is a PCI/104-Express Type 1 Single Board Computer (SBC) featuring the 64-bit Intel® 6th Core™ i3 processor (formerly «Skylake-H»), supported by the Intel® CM236 Chipset. The CMx-SLx is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. The CMx-SLx Intel processor supports Intel Hyper-Threading Technology (i3-6102E = 2 cores, 4 threads) and 8/16 GB of soldered ECC DDR4 memory at 1866/2133 to achieve optimum overall performance. Integrated Intel® Generation 9 Graphics includes features such as OpenGL 5.x, OpenCL 2.x, DirectX 2015, DirectX 12, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full HEVC/VP8/VP9/AVC/MPEG2 hardware codec. Graphics outputs include single-channel 18/24-bit LVDS (eDP x4 lanes optional) and three DDI ports supporting HDMI/DVI/DisplayPort. The CMx-SLx is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. The CMx-SLx features one mini DisplayPort (DDI1), one micro HDMI port (DDI2), and one single channel 18/24-bit LVDS port (eDP), two Gigabit Ethernet ports, four USB 2.0 ports, two COM ports, eight GPIOs (from BMC), two SATA 6Gb/s ports, and one onboard SATA SSD supporting SLC (up to 32GB) and MLC (up to 64GB). The module is equipped with an SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as fail safe BIOS, remote console, CMOS backup, hardware monitor, and watchdog timer. The CMx-SLx is capable of working in the temperature ranges of 0°C~60°C (standard) and −40°C~85°C (extended).
nanoX-BT
nanoX-BT COM Express Mini Size Type 10 Module with Intel Atom E3800 series SoC or Celeron Processors (codename: Bay Trail) The nanoX-BT is a COM Express COM.0 R2.1 Type 10 module supporting Intel Atom processor E3800 Series and Intel Celeron N2930/J1900 processor SoC (codename: Bay Trail). The nanoX-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution. The nanoX-BT features Intel Atom processor E3800 and Intel Celeron N2930/J1900 processor supporting non-ECC type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Integrated Intel Gen7 HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1 and support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include DDI ports supporting HDMI/DVI/DisplayPort and single-channel 18/24-bit LVDS (eDP is optional). The nanoX-BT is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. The nanoX-BT has soldered type non-ECC DDR3L memory for up to 4 GB. In addition, onboard eMCC memory (8/16/32GB) and SDIO signals are optionally supported. The nanoX-BT features a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 3 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
Q7-BW
Q7-BW Qseven Standard Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET. The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for -PCI Express graphics cards in notebooks. The Qseven footprint is smaller than that of COM Express, ETX or XTX, responding to system designers" needs for minimal space. Qseven"s power consumption envelope is below a 12 watts target, whereas SMARC"s target is below 6 watts and COM Express can be well above 20 watts. Therefore, Qseven designs provide mid-range power values between those of SMARC and COM Express. The Qseven pincount is 230 compared to 314 and 440 for SMARC and COM Express (Type 2), respectively. Thus, it is optimized for designs with lower board-to-board pin requirements. The ADLINK Q7-BW computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Q7-BW is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Q7-BASE
Q7-BASE Qseven® Reference Carrier Board Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET. The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for -PCI Express graphics cards in notebooks. The Qseven footprint is smaller than that of COM Express, ETX or XTX, responding to system designers' needs for minimal space. Qseven's power consumption envelope is below a 12 watts target, whereas SMARC's target is below 6 watts and COM Express can be well above 20 watts. Therefore, Qseven designs provide mid-range power values between those of SMARC and COM Express. The Qseven pincount is 230 compared to 314 and 440 for SMARC and COM Express (Type 2), respectively. Thus, it is optimized for designs with lower board-to-board pin requirements.
nanoX-TC
nanoX-TC COM Express® Mini Size Type 10 Module with Intel® Atom™ Processor No bigger in size than a business card, the nanoX-TC is a COM Express™ Mini form factor Type 10 pinout compatible computer-on-module that targets battery powered, mobile and handheld system designs. The new Mini size form factor with a footprint of just 55 mm x 84 mm is the smallest size in ADLINK's COM Express product lineup, next to the Basic size (125 mm x 95 mm) and Compact size (95x95) form factors. The nanoX-TC is based on the Intel® Atom™ Processor E6xx with less than 3.9 W thermal design power (TDP). These new 45nm Intel architecture processors implement ground-breaking power management techniques, making them ideal for thermally constrained and fanless embedded applications. The Processor E6xx series offers an integrated 2D/3D graphics engine with hardware encode/ decode, LVDS and SDVO output, HD Audio, PCI Express, and support for Intel® Hyper-Threading and Intel® Virtualization Technology. The Intel® EG20T Platform Controller Hub (PCH) provides additional I/O flexibility with SATA, UART, Gigabit Ethernet and USB host/client support. The nanoX-TC allows for innovative designs in mobile and "light" computing, including portable and mobile equipment for the automotive and test and measurement industries, visual communication and in the medical field. Using the Intel® Atom™ Processor E6xx and Intel® EG20T PCH chipset, the nanoX-TC allows developers to utilize a wide variety of mainstream software applications and middleware familiar to end users that will run unmodified with full functionality on this platform.
LEC-BW
LEC-BW SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. The ADLINK LEC-BTS computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BTS is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities. To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.
LEC-BTS
LEC-BTS SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. The ADLINK LEC-BTS computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BTS is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities. To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.
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