Q7-BW
Vendor:ADLINK Technology Inc.
- Details
- Specification
- Order information
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- Dual or quad core Intel® N3000 Series System-on-Chip
- Up to 8 GB DDR3L at 1600 MHz
- eDP, LVDS, HDMI/DP
- Operating Temperature 0°C to +60°C
Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET.
The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for -PCI Express graphics cards in notebooks.
The Qseven footprint is smaller than that of COM Express, ETX or XTX, responding to system designers" needs for minimal space. Qseven"s power consumption envelope is below a 12 watts target, whereas SMARC"s target is below 6 watts and COM Express can be well above 20 watts. Therefore, Qseven designs provide mid-range power values between those of SMARC and COM Express.
The Qseven pincount is 230 compared to 314 and 440 for SMARC and COM Express (Type 2), respectively. Thus, it is optimized for designs with lower board-to-board pin requirements.
The ADLINK Q7-BW computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Q7-BW is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
| Technical specifications | |
|
Core System |
|
|---|---|
| CPU |
Intel Pentium N3710, 4 cores, 2.6GHz, 6W TDP Intel Celeron N3160, 4 cores, 2.2GHz, 6W TDP Intel Celeron N3060, 2 cores, 2.5GHz, 6W TDP Intel Celeron N3010, 2cores, 2.2GHz, 4W TDP |
| Memory | Up to 8 GB DDR3L at 1600 MT/s single channel, 64bit |
| Embedded BIOS | AMI UEFI with CMOS backup in 8 MB SPI BIOS, Fast Boot support |
| Cache | 2 MB L2 cache |
| SEMA Board Controller | Supports: Voltage/Current monitoring, Power Sequence debug support, AT/ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control |
|
Video |
|
| GPU Feature Support |
8th generation Intel® graphics core architecture with sixteen execution units, supports three independent displays 4K video (up to 3840 x 2160 @ 30fps) 2D and 3D graphics hardware acceleration Support for DirectX 12/11.2, OpenGL 4.2/3.3, OpenCL 1.2 Video decode HW acceleration for HH.265, H.264, MPEG2, MVC, VC-1, WMV9, JPEG, VP8 Video encode HW acceleration for H.264, MVC, JPEG |
| Stand ard Displays |
Single/dual channel 18/24-bit LVDS HDMI/DP (3840x2160@30Hz or 2560x1600@60Hz) |
| Custom Options |
2x eDP (2560 x 1440 @ 60Hz) HDMI/DP |
|
Audio |
|
| Port | Intel® HD Audio for Audio codec on carrier |
|
Ethernet |
|
| Intel® MAC/PHY | 1x Intel® i211 Ethernet controller |
| Interface | 10/100/1000 GbE connection |
|
I/O Interfaces |
|
| PCIe | 3x PCIe x1 Gen2 |
| USB | 1x USB 3.0 host + 5x USB 2.0 host + 1x USB 2.0 client |
| SATA | 2x SATA3 6Gbit/s or 1x SATA and 1x SATA-SSD (optional) |
| SSD | onboard SATA-SSD (optional) |
| SDIO | 1x SDIO 3.0 (4bit) |
| Camera | 2x MIPI CSI 4L/2L camera support |
| Serial | 2x SPI, 1x I2C, 1x UART, 1x DB40, 1x HDA, 1x SMBus, 1x LPC |
| eMMC | Onboard eMMC (optional) |
|
Power |
|
| Standard Input | 5.0 V ±5% |
| Power States | Supports C0-C6, S0, S3, S4, S5 |
|
Other |
|
| Form Factor | Qseven Specification v2.0 |
| Dimension | Standard size, 70 mm x 70 mm |
| Operating Systems |
Standard Support: Linux, Windows 7/8.1/10 Extended Support (BSP): QNX, Android, VxWorks |
|
Environmental and physical specifications |
|
| Operating Temperature | Standard: 0°C to +60°C |
| Humidity |
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) |
| Shock and Vibration |
IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
| Model | Description |
| Q7-BW41-4G-8G-CT | Qseven module with Intel Pentium N3710, quad core, 4 GB DDR3L, 8 GB eMMC, 0°C to 60°C |
| Q7-BW42-4G-8G-CT | Qseven module with Intel Celeron N3160, quad core, 4 GB DDR3L, 8 GB eMMC, 0°C to 60°C |
| Q7-BW42-4G-8GS-CT | Qseven module with Intel Celeron N3160, quad core, 4 GB DDR3L, 8 GB SATA SSD, 0°C to 60°C |
| Q7-BW21-2G-8G-CT | Qseven module with Intel Celeron N3060, dual core, 2 GB DDR3L, 8 GB eMMC, 0°C to 60°C |
| Q7-BW22-2G-8G-CT | Qseven module with Intel Celeron N3010, dual core, 2 GB DDR3L, 8 GB eMMC, 0°C to 60°C |
| Q7-BW-HS | Heatspreader for Q7-BW |
| Q7-BW-HS2 | Passive heatsink for Q7-BW, 0°C to 60°C |
